Navitas Collaborates with NVIDIA MGX™ Ecosystem to Accelerate 800 VDC AI Infrastructure
NVIDIA MGX Ecosystem - Navitas Semiconductor (Nasdaq: NVTS), an industry leader in next-generation GaNFast™ gallium nitride (GaN) and GeneSiC™ silicon carbide (SiC) power semiconductors, was honored to participate in NVIDIA's Partner Ceremony held on May 29th, 2026, at the Taipei Nangang Exhibition Center. The event brought together key ecosystem partners supporting the NVIDIA AI Factory MGX™ platform, highlighting industry collaboration to...
Indium Corporation, Ames National Laboratory Team Up to Establish U.S. Gallium Supply Chain
U.S. Gallium Supply Chain - Indium Corporation and Ames National Laboratory have announced a research and development partnership to expand U.S. production of gallium, a critical material used in semiconductors and electronics, including smartphones, LED lighting, and optoelectronics. The new alliance will focus on developing the technologies needed to establish a domestic supply chain for an element that currently relies...
HKUST and CalmCar Establish the Physical AI Innovation Center, Ushering in a New Era of Physical Intelligence
Physical AI Innovation Center - The Hong Kong University of Science and Technology (HKUST) and Suzhou Calmcar Electronics Technology Co., Limited (CalmCar) yesterday officially signed a strategic agreement to jointly establish the Physical AI Innovation Center. The Center is dedicated to advancing full-stack physical AI technologies, addressing fundamental bottlenecks in current AI, including an insufficient understanding of the...
Fujitsu and Daiichi Life Explore Quantum Technology in Insurance Asset Management
Quantum Technology in Insurance Asset Management - Fujitsu Limited and Daiichi Life Group, Inc. today announced that they conduct joint research from April 2026 to March 2027 to advance asset management operations through the application of quantum technology in the insurance sector.This joint research will leverage the expertise of Daiichi Life Insurance Co., Ltd., a leading institutional...
DEVELOP HIGH-FREQUENCY PCB APPLICATIONS WITH SOLDERLESS 2.92 MM CONNECTORS
SOLDERLESS 2.92 MM CONNECTORS - Amphenol RF is pleased to introduce 2.92 mm connectors engineered for high-frequency applications that require reliable signal integrity and repeatable mechanical performance. These vertical PBC jacks are available in stripline and microstrip configurations and eliminate solder joint variability. Solderless 2.92 mm connectors provide secure PCB attachment for microwave and millimeter-wave systems, prototyping...
Why Resident Safety Is a Growing Priority for Apartment Communities
Introduction
Apartment communities are no longer judged only by floor plans, amenities, location, and rental rates. Resident safety has become one of the most important parts of how people evaluate where they live. A property may offer modern interiors, fitness rooms, parking, package lockers, and shared outdoor spaces, but if residents feel uneasy walking...
NeoMesh e-IoT Platform from NeoCortec Powers Endrich Bauelemente Industrial IoT Solutions
NeoMesh e-IoT Platform - In addition to being one of NeoCortec's key distribution partners, NeoCortec is also partnering with Endrich Bauelemente Vertriebs GmbH for powering their e-IoT platform with its low power and highly scalable NeoMesh wireless mesh networking protocol and software stack. Endrich's e-IoT platform supports customers in the digitalization of their industrial processes and includes IoT nodes, smart sensors,...
ROHM 750V SiC MOSFET AI Server BBU for Next-Gen HVDC Power Architectures
ROHM 750V SiC MOSFET AI Server BBU - ROHM Co., Ltd. has announced that its 750 V SiC MOSFET has been adopted in a BBU (Battery Backup Unit) for AI server power supplies. With the rise of generative AI, AI server power systems are shifting to higher voltages and rapidly transitioning to HVDC (high-voltage direct current) architectures....
Wise Integration PCIM 2026: Showcasing WiseWare®-Powered AC-DC Demo Boards and Digital Control Roadmap
Wise Integration PCIM 2026 - Wise Integration will showcase its latest WiseWare®-powered AC-DC demo boards at PCIM 2026 (June 9–11, Nuremberg), highlighting its roadmap toward distributed digital control with the new generation of WiseGan® Digital First power ICs.
A pioneer in digital control for wide-bandgap and GaN IC-based power supplies, the company places digital...
AAEON DEEPX AI Semiconductor Partnership Strengthens Edge AI Innovation with Three-Year MOU
AAEON DEEPX AI Semiconductor Partnership - Leading provider of advanced industrial and embedded AI computing platforms AAEON (Stock Code: 6579) has confirmed that it has signed a three-year Mass Production Cooperation MOU with South Korean AI semiconductor company DEEPX Inc. The ceremony, which took place at the DEEPX exhibition booth in Hall 1 of the Taipei Nangang...

















