Die-to-Wafer Self-Assembly Breakthrough Targeting High Alignment Accuracy and Throughput
In a breakthrough for the future of die-to-wafer (D2W) bonding, CEA-Leti and Intel have optimized a hybrid direct-bonding, self-assembly process that has...
Vitesco Technologies relies on Infineon for silicon carbide power semiconductors
Vitesco Technologies further strengthens its position in the field of silicon carbide (SiC) semiconductorsThe cooperation with Infineon opens up the possibility of...
CDAC to pool the Design licenses centrally to be made available to students at...
Ministry of Electronics and Information Technology (MeitY) with its series of graded and proactive steps, is in the process of systematic overhaul...
Showa Denko’s Program to Develop 8-inch SiC Wafers for Next-Gen Green Power Semiconductor
Showa Denko (SDK) proposed its “Project to Develop SiC Wafers Technology for Next-generation Green Power Semiconductors*1” (hereinafter “the Project”) to New Energy...
Vicor Announced Industry’s First “Converter Housed in Package” Fabrication Facility
On May 18, state and local officials celebrated the opening of a new, state‑of‑the‑art power module manufacturing facility. The world’s first ChiP...
Record-breaking digitizers get the next variant
The world's first digitizers to use the full 16-lane PCIe interface (Gen 3) for massive data streaming generated huge interest in the...
Key Takeaways from Semicon India Conference 2022
Semicon India conference highlights 2022
PM Modi inaugurated India’s first global semiconductor conference, Semicon India 2022 in Bengaluru, Karnataka....
Top 10 Companies Hold 57% of Global Semi Marketshare
IC Insights' 2Q Update to The McClean Report 2022 will be released in May. It presents an analysis of the marketshare of the major semiconductor suppliers...
DENSO and USJC Collaborate on Automotive Power Semiconductors
DENSO Corporation and United Semiconductor Japan Co., Ltd. today announced that the companies have agreed to collaborate on the production of power semiconductors...
Wafer Capacity to Grow 8.7% As 10 New Fabs Enter Production
The volatile nature of the IC industry is reflected by large swings in annual wafer starts. Over the past five years, for example,...