Indium Corporation will feature its reinforced solder alloy fabrications, InFORMS®, at Productronica, November 12-15, Munich, Germany.
Indium Corporation is redefining solder with its InFORMS solder preforms and patent-pending solder ribbon. InFORMS are a composite solder material with a reinforcing matrix. This results in:
- Improved mechanical and thermal reliability
- Uniform bondline thickness
- Low-voiding performance
InFORMS do more than just bond two surfaces—they are designed to address specific challenges of the power electronics industry. InFORMS provide engineers with an enhanced material for the development of more reliable and higher performance modules. Due to the planarity improvements and stand-off tolerances, the package design becomes more predictable. In addition, stronger and more dependable joints allow for high power densities.
For more information about InFORMS, visit www.indium.com/informs or visit the Indium Corporation at Productronica, Hall A4, Booth 214.
