Printed Electronics News and Latest Innovation - Emedia

PCB

Comparison between Standard PCB and thick copper PCB

Introduction Printed Circuit boards (PCBs) handle supplying electrical connection between the different components of a motherboard. They are used in...
PCB-Mount Current Transducer

PCB-Mount Current Transducer for isolated DC & AC current measurement

Danisense launched its ultra-stable, high-precision DP series of PCB-mount current transducers for isolated DC and AC current measurement up to 72A. With...
DIY Printed Circuit Boards

Conditions that Must be Met Before DIY Printed Circuit Boards

Printed circuit boards (PCBs) are vital components of most electronic devices and equipment these days. Designing your own may be a good idea to...
Why Multilayer PCBs

Why Multilayer PCBs?

With the technology arising, it is needless to say that electronics have made our lives easier and people can hardly survive without them. All...
Inspection Tool to find defects on assembled PCBs

Overlay Assisted Inspection Tool for identifying Defects on Assembled PCBs

The fastest and most accurate technique for the human eye and mind to detect defects is through visual comparison of graphic images....

Innovative X-ray Proof Encapsulation Resin launched by Electrolube

Global Electro-chemicals and circuit protection specialist, Electrolube has today announced the development of a highly innovative X-ray proof encapsulation resin. Using key...
Solder paste

“Solder paste is our main driver for the Indian market”- Christopher Nash, Indium Corporation

Indium Corporation has a fascinating history of 85 years. Electronics Media spoke to Christopher Nash, Indium Corporation to find out how material science is...
Solder Paste

Indium Corporation to Feature Indium8.9HF Solder Paste at High-End SMT Academic Conference

Indium Corporation will feature its Indium8.9HF Solder Paste at the China High-End SMT Academic Conference, Oct. 23, Chengdu, China. Indium8.9HF is an...

Indium Expert to Present Flux Systems in Solder Pastes at IMAPS Autumn Conference 2019

Indium Corporation expert Andreas Karch, Regional Technical Manager, Germany, Austria, and Switzerland, will present at the IMAPS Autumn Conference 2019, October 17-18,...
packaging technology i

New Source Down Packaging Technology

Alpha and Omega Semiconductor Limited (AOS) introduced the a new "Source Down" packaging technology in a DFN 5x6 package with a 40V Shield-Gate...

Interview