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Vicor Announced Industry’s First “Converter Housed in Package” Fabrication Facility
On May 18, state and local officials celebrated the opening of a new, state‑of‑the‑art power module manufacturing facility. The world’s first ChiP...
Silicon Labs adds 32-Bit MCU to Wireless SoCs family for Embedded IOT Applications
Silicon Labs is extending its FG23 and ZG23 families of wireless SoCs with the PG23, a 32-bit microcontroller (MCU), offering best-in-class security, extremely low-power operation,...
STMicroelectronics join hands with Microsoft for Highly Secure IoT Devices
Joint efforts deliver Microsoft Azure IoT cloud reference implementation integrating Arm® trusted firmware and based on STM32U5 IoT discovery kit
High Current, Thermally Efficient Power Packaged MOSFET for Electric Vehicle
Diodes Incorporated has announced the PowerDI 8080-5, an innovative high current, thermally efficient power package that meets the needs of electric vehicle (EV) applications. The first product to be released in the...
Pickering Interfaces Improves Sensor Simulation Accuracy with Precision Resistor Module Family
Pickering Interfaces has added new models to its high-density precision resistor module family, improving sensor simulation accuracy. The updated 40-297A (PXI) and the new 42-297A (PXIe) modules are now available with additional resolutions -...
32-Lane PCIe 3.0 Packet Switch IC from Diodes Incorporated
Diodes Incorporated (Diodes) announced the introduction of a PCIe® 3.0 packet switch IC. DIODES™ PI7C9X3G1632GP provides flexible multi-port and lane width configuration, resulting in elevated levels of performance and availability. This...
