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H19 fibre optic shield

Arduino shield simplifies use of fibre-optic datalink in MPU designs

OMC, the pioneer in optoelectronics design & manufacture, has launched  an H19 fibre optic shield, compatible with Arduino Uno, to demonstrate how...
Eye on Intelligence

element14 Community Launches “Eye on Intelligence” Design Challenge

element14, an Avnet Community, in collaboration with AMD, has launched the "Eye on Intelligence" design challenge. This innovative competition invites participants to...
Custom Metal Keyring

The Impact of Different Production Methods for Custom Metal Keyrings on Their Effectiveness

Businesses are increasingly choosing metal keyrings for marketing, promotional, and corporate gifting purposes. Even though this product is very effective, its manufacturing...
Reference Design: Utilizing PMICs and SerDes ICs for SoC

ROHM and Nanjing SemiDrive Technology jointly Develop a Reference Design: Utilizing PMICs and SerDes...

ROHM and Nanjing SemiDrive Technology Ltd., China’s largest SoC manufacturer for smart cockpits, have jointly developed a smart cockpit reference design. The...
iWave Launches iW-RainboW-G61M

iWave Launches iW-RainboW-G61M

iWave is excited to announce the launch of the iW-RainboW-G61M System on Module, powered by NXP Semiconductors i.MX 95 applications processor. Built...
HQDFM Online Lite Edition, a PCB Gerber Viewer

NextPCB Unveils Latest Addition: Introducing HQDFM Online Lite Edition, a PCB Gerber Viewer

Introducing HQDFM Online Lite Edition, a PCB Gerber Viewer, marks a significant leap in accessibility and convenience for electronic design enthusiasts and...
DART-MX93

DART-MX93 System on Module for ML-Optimized Edge Devices

Variscite, a leading worldwide System on Module (SoM) designer, developer and manufacturer, announced the newest member of the DART Pin2Pin family for...
Solder Paste for AI Substrate Power Management Modules

SHENMAO Debuts Special Solder Paste for AI Substrate Power Management Modules

SHENMAO Technology proudly presents its latest innovation, the PF719-P250A solder paste, specifically designed for AI substrate power management modules. This cutting-edge solder...
Next-Level Chip Innovation on TSMC Advanced Processes

Synopsys Accelerates Next-Level Chip Innovation on TSMC Advanced Processes

Highlights: Production-ready digital and analog design flows, powered by Synopsys.ai™ EDA suite, on TSMC N3/N3P and N2 drive successful results...
Advanced Chip Designs with Synopsys IP and Certified EDA Flows for Intel 18A Process

Synopsys and Intel Foundry Accelerate Advanced Chip Designs with Synopsys IP and Certified EDA...

Synopsys, Inc. announced its AI-driven digital and analog design flows are certified by Intel Foundry for the Intel 18A process. In addition,...

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