Semiconductor Assembly and Test Services Market

Semiconductors have made their presence in almost every industry vertical. The market for semiconductor assembly and test services (SATS) is projected to expand gradually, with the growing trend of outsourcing by OEMs and chipmakers.

Semiconductor assembly and test services have been shifting toward the outsourcing business mode over the last few years. This shift toward the outsourcing of SATs is expected to increase in the next few years, as OEMs and device manufacturers are trying to keep pace with the growing complexity in the packaging technology.

Advancements in packaging technology with the development of wafer-level processes have transformed providers of semiconductor assembly and test services into technology enablers for emerging applications in consumer electronics and computing.

In terms of revenue, the global SATS market is estimated to expand at a CAGR of ~ 6% during the forecast period, owing to numerous factors, regarding which, TMR offers thorough insights and forecasts in its report on the global semiconductor assembly and test services market.

In this research report, TMR mentions that, wafer level packaging is estimated to be the most rapidly expanding service segment of the global SATS market by 2027.

The rising demand for consumer electronics products is the key factor driving the demand for semiconductor assembly and test services across the globe.

The increasing demand for high-end electronics systems for use in automobiles is also expected to drive the global semiconductor assembly and test services market from 2019 to 2027.

Over the last decade, prominent countries in Asia Pacific have witnessed an alarming rate of forgeries/counterfeiting in semiconductor assembly and test services. This has augmented the demand for semiconductor assembly and test services in the region.

In addition to this, the increasing demand for semiconductor assembly and test services (SATS) and outsourced semiconductor assembly and test services (OSATS) is likely to drive the global semiconductor assembly and test services market during the forecast period.

Global Semiconductor Assembly and Test Services Market

However, advancements in semiconductor inspection equipment involve packaging and testing, which incurs high costs. This is likely to adversely impact the global semiconductor assembly and test services market in the near future. Thus, the high costs associated with larger wafer fabrication are expected to hamper the global SATS market during the forecast period.

Global Semiconductor Assembly and Test Services Market: Prominent Regions

Asia Pacific is estimated to present prominent growth opportunities to the semiconductor assembly and test services market in the next few years. Also, the growing automobile industry in the region is fueling the market in Asia Pacific.

In the developed regions of North America and Europe, advancements in semiconductor technologies is a significant factor driving the semiconductor assembly and test services market in these regions.

Manufacturers operating in the global semiconductor inspection industry, especially those in North America and Europe, are focusing on research and development activities to enhance their technological competence. These manufacturers are continuously engaged in the production of advanced semiconductor inspection equipment.

semiconductor assembly and test services market

Key manufacturers operating in the global semiconductor assembly and test services market are displaying synergies through close cooperation and collaborations in the areas of sales, marketing, and production. These manufacturers are also expanding through organic methods, such as increasing production capacity, so as to meet the increasing demand.

Global Semiconductor Assembly and Test Services Market: Key Players

Key players operating in the global semiconductor assembly and test services market include ASE Technology Holding Co., Ltd., Amkor Technology, Powertech Technology Inc., Chipbond Technology Corporation, Integrated Micro-Electronics, Inc., GlobalFoundries, UTAC Group, TongFu Microelectronics Co., Ltd., King Yuan ELECTRONICS CO., LTD. and ChipMOS TECHNOLOGIES INC.

For more information visit: TMR website