MIPI I3C Interop Workshop
Source MIPI Alliance/photographer: Angelika Güc.

The MIPI Alliance, an international organization that develops interface specifications for mobile and mobile-influenced industries, announces the successful completion of a MIPI I3C Interop Workshop testing event in Munich.

MIPI I3C Interop Workshop

The June 13-14 plugfest, which coincided with MIPI’s 60th member meeting, engaged 16 MIPI I3C/I3C Basic implementers from seven companies in a range of interoperability testing (from initial to advanced) for their innovations. Interoperability between multi-vendor controller and target devices was tested in a confidential environment with a mix of electronics manufacturers, including both MIPI members and nonmembers, illustratinga broad range of applications and a commitment to the MIPI I3C interface. Bin1ho LLC, Intel Corporation, Introspect Technology, Prodigy Technovations Pvt. Ltd., Robert Bosch S.p.A., and STMicroelectronics were among the companies to participate in the workshop.

MIPI I3C is a scalable, intelligent utility and control bus interface for connecting peripherals to an application processor, giving developers unprecedented opportunities to craft innovative designs for an array of products—smartphones, personal computers, wearables, IoT devices, systems in automobiles and other devices. Designed as the successor to I2C, I3C incorporates key attributes of the traditional I2C and SPI interfaces to provide a high-performance, very-low-power solution with backward compatibility and a robust, flexible upgrade path. 

The MIPI I3C specification is available to MIPI members, while the publicly available, royalty-free MIPI I3C Basic is a subset of I3C that bundles the most commonly needed I3C features for developers and other standards organizations. MIPI I3C Basic has been adopted into JEDEC’s Sideband Bus and DDR5 standards, and in June, MIPI and ETSI Technical Committee Secure Element Technologies (TC SET) announced the adoption of I3C Basic as a physical and logical link layer for the ETSI Smart Secure Platform (SSP).

“Interoperability testing early in the design cycle is crucial to reducing time to market and ensuring seamless functionality among multi-vendor devices in deployment,” said Sanjiv Desai, chair of MIPI Alliance. “Events such as the MIPI I3C Interop Workshop are so important because they help companies optimize the manufacturability of their designs, avoid deployment issues and deliver higher-quality products upon which their customers can rely from day one.”

Additional plugfest opportunities are planned in conjunction with future in-person MIPI Alliance member meetings.