Indium Corporation Strategic Advisor Dr. Dongkai Shangguan is scheduled to deliver a keynote presentation at NordPac, hosted by IMAPS, June 12-14, in Oslo, Norway.
The presentation, titled Interconnect Reliability: From the Chip to the System, examines the importance of interconnect reliability to the overall integrity of semiconductor packaging and electronic systems. As newer forms of interconnects emerge to meet the demand for high density and high performance, interconnect reliability is becoming more complex and more critical. The growing adoption of heterogeneous integration leads to increased diversity of interconnects (with different geometries, materials, and interfaces) in the same package, with complex (and often interactive) reliability failure modes and mechanisms.
“As an international gathering of microelectronics packaging experts, from both academia and industry, NordPac is a tremendously valuable forum for discussing the groundbreaking research taking place throughout the field,” said Dr. Shangguan. “I am honored that IMAPS has invited me to deliver a keynote presentation to my esteemed colleagues at this important event.”
Dr. Shangguan is a Strategic Advisor to Indium Corporation. In this role, he works on specific trends related to the advanced semiconductor packaging and SMT industries, and applies his significant industry experience to supporting customers. Dr. Shangguan is an IEEE Fellow and IMAPS Fellow, and has served on the boards of directors for several professional organizations and industry associations, including IPC, IEEE EPS, and iNEMI. He also served as a Distinguished Lecturer for IEEE EPS. He has been honored with some of the industry’s most prestigious awards, including IPC’s President’s Award, the Society of Manufacturing Engineers’ (SME) Total Excellence in Electronics Manufacturing Award, the Outstanding Sustained Technical Contribution Award from IEEE EPS, and the William D. Ashman Achievement Award from IMAPS, among others.
Dr. Shangguan received a bachelor’s degree in mechanical engineering from Tsinghua University, China, an MBA from San Jose State University, Calif., and a Ph.D. in materials from the University of Oxford, U.K. He has held postdoctoral positions at the University of Cambridge, U.K., and the University of Alabama, and has served as a guest professor at several universities. Dr. Shangguan has published two books, more than 200 scientific papers and technical articles, and has given numerous presentations to share knowledge and expertise with the industry. He is the inventor/co-inventor of 30 U.S. patents and several foreign patents.
