Indium Corporation R&D Sintering Project Manager Demi Yao will deliver a presentation on pressure-less copper sintering paste for die-attach applications at the Electronics Packaging Technology Conference (EPTC) on December 8 in Singapore.
The presentation will examine a new version of pressure-less copper (Cu) sintering paste, developed for die-attach and IGBT bonding, to overcome the imperfections of silver (Ag) sintering material.
“With lead-free bonding materials on the rise since the introduction of the RoHS lead-free materials regulation, researchers and industry have been working on new materials that are expected to perform comparably to lead-based pastes,” said Yao. “Simultaneously, many high-performance application industries, such as modern electronics, LED, and e-Mobility, are developing rapidly and generate large amounts of heat.”
Yao manages the research and development of advanced sintering projects by identifying opportunities to collaborate with customers. She collaborates with, and uses input from, marketing and sales team members, as well as customers, to design and develop new materials. Yao joined Indium Corporation in 2015 as a Research Scientist for sintering materials. In this role, she successfully developed pressure/pressure-less Cu Sintering paste. Yao earned her Ph.D. from Central China Normal University in Wuhan. She was a member of the Chinese-American exchange Ph.D. program, where she studied at the University of Kentucky during her Ph.D. program. In 2017, Demi was awarded the IMPACT “Best Paper Award.”
