Braided Solder Columns are the revolutionary, robust new solution to manufacturing challenges posed by next generation large packages in electronics assembly. Martin Hart, President of TopLine Corporation and holder of multiple patents in the field of electronic components, will present “Braided Solder Columns for Next Generation Large Heterogeneous 2.5D Packages” at the CMSE 2025 conference and exhibition at the Renaissance Los Angeles Airport Hotel in Los Angeles, California on April 30, 2025.
“Braided Solder Columns are non-collapsible, robust and compliant structures used for reducing stress caused by CTE mismatch,” Hart says. “Columns are more reliable than solder balls, especially when connecting large-size chip packages to PC Boards operating in cryogenic environments. Additionally, they are available with lead for Aerospace & Defense applications, but also available in lead-free designs for RoHS AI Datacenters, for example.”
CMSE 2025 is the 28th Annual Components for Military & Space Electronics Conference & Exhibition, billed as the premier event focused on the design, reliability, and application of electronic components for use in both terrestrial applications for avionics, aerospace, and military, as well as commercial, civilian, and military space systems.
For more information, visit Booth #12 or contact TopLine Corporation at 95 HWY. 22 W., Milledgeville, GA 31061 USA Telephone: 800-776-9888, Email: info@topline.tv.
To learn more, visit www.CCGA.tv.
