Nordson Test & Inspection announced plans to present on Day 2 at the Heterogeneous Integration Global Summit (HIGS), during SEMICON Taiwan at the TaiNex in Taipei, Taiwan from September 8-12. Nordson Test & Inspection is a platinum sponsor and will also be demonstrating state-of-the-art Optical, X-Ray and Acoustic Inspection & Metrology systems and sensors in in booth #12326.
Heterogeneous Integration (HI) is revolutionizing semiconductor technology, driving advancements in performance, efficiency and scalability. The theme of Day 2’s Heterogeneous Integration Summit session, led by forum chairs, Dr. C.P. Hung, Vice President, ASE Inc. and Dr. Yu Po Wang, Vice President, SPIL is ‘Revolutionizing Heterogeneous Integration: Pioneering Trends, Breakthrough Applications, and Future Solutions.’ Vidya Vijay, Director of Business Development at Nordson, will be presenting ‘Inspection & Metrology Technologies for Mid-End and Back-End Semiconductor that Improve Yields, Processes and Productivity.’
In the fast-paced world of semiconductor manufacturing, precision and efficiency are paramount. The semiconductor packaging industry continues to advance, with new designs adding more layers, finer features and more I/O channels for higher bandwidth and lower power consumption. Manufacturers face an increasing need for high-precision inspection and measurement to detect defects and improve process control. The presentation will focus on two optical and acoustic technologies for mid-end and back-end semiconductor inspection and metrology that improve yields, processes and productivity.
In the Optical category, Vidya will highlight an industry-leading optical sensing technology, called Multiple Reflection Suppression (MRS) that eliminates reflection-based distortion from shiny and specular surfaces to enable highly accurate, high-speed inspection and metrology.
She will also share a new, revolutionary approach to automated Acoustic Micro Imaging Inspection (AMI) called SpinSAM technology. The SpinSAM AMI system delivers industry-leading throughput at 41wafers per hour. With unparalleled sensitivity, it is the ultimate solution for accurately locating defects in a variety of wafer applications. What distinguishes this new system is its innovative spinning scan method. It is meticulously engineered to maximize Units Per Hour (UPH), geared towards 100% inspection, without compromising accuracy. Ideal applications include bonded wafers, chip-on-wafer, stacked wafers, MEMs HBM wafers, over molded wafers and more.
Discover how innovations like MRS sensors and SpinSAM technologies are driving higher yields and smarter process control in an increasingly complex semiconductor landscape. For more information, visit www.nordson.com/testinspect.
