YINCAE, a leader in advanced electronic materials, has introduced Diamond Underfill UF 158D, delivering 8 W/m·K thermal conductivity—a new standard in heat dissipation for advanced semiconductor packaging.
Built with nano-engineered diamond particles, UF 158D combines high thermal performance with excellent mechanical reliability, low CTE mismatch, and strong adhesion. It is optimized for flip-chip, 2.5D/3D packaging, and high-density interconnects, reducing solder fatigue and extending device lifetime.
“UF 158D enables customers to push semiconductor performance further without sacrificing reliability,” said Dr. Wusheng Yin, CEO of YINCAE.
The product is available in both dispensable and jettable formulations and has passed JEDEC reliability testing.YINCAE will showcase UF 158D at IMAPS 2025 in San Diego from September 30 to October 1 at Booth #817, and at SMTAI 2025 in Chicago from October 21 to 23 at Booth #2551.
For more information on YINCAE’s UF 158D underfill, or to learn more about the YINCAE product range, please email us at: info@yincae.com. You can also find more information by visiting our website at: www.yincae.com
