Marvell Technology, Inc., a leader in data infrastructure semiconductor solutions, announced it will showcase its extensive, industry-leading interconnect portfolio for scale-up and scale-out data center AI deployments at the European Conference on Optical Communication (ECOC), September 28 to October 2 in Copenhagen, Denmark.
The rapid evolution of generative AI technologies and large-scale models is redefining data center architectures, driving unprecedented demand for interconnect performance, bandwidth and power efficiency. This transformation is accelerating the need for high-performance silicon, advanced memory architectures and tightly integrated optical connectivity. As hyperscalers scale massive AI compute clusters across racks, campuses and multi-site topologies, interconnect technologies must be developed to deliver efficiency, scalability and workload-optimized performance.
Marvell is addressing this challenge with a full-stack approach—combining advanced silicon platforms, chiplet-based architectures and breakthrough optical technologies. Together, these innovations unlock new levels of performance across scale-up and scale-out fabrics, reduce latency, lower power consumption, and enable faster deployment at cloud scale.
At ECOC 2025 (stand #C4134), Marvell will showcase technologies that will drive the next generation of AI interconnects, including:
- Co-packaged Optics (CPO) for AI Scale Up: CPO platform supporting 200G/lane connectivity for energy-efficient, high-bandwidth links spanning multiple racks within an AI scale-up domain.
- Marvell® COLORZ® 800G ZR/ZR+ for Multi-Site AI Training: Industry-first family of 800 Gbps ZR/ZR+ coherent pluggable optical modules. Supports transmission up to 2,000km, enabling cost-effective, scalable data center interconnect (DCI) between geographically distributed AI clusters.
- 200G/Lambda 1.6T PAM4 Optical Interconnect: Marvell Ara, the industry-first 3nm PAM4 DSP, combines eight 200 Gbps channels inside a single optical module, enabling rapid deployment of AI scale-out fabrics across rows and data halls.
Marvell experts will also deliver presentations on interconnect technologies designed to scale accelerated infrastructure:
- Market Focus: Outlook for Coherent Lite Technologies and Markets
Date: Monday, September 29, 2025
Time: 10:20 – 10:35 a.m. CET
Marvell Presenter: Bo Zhang, senior principal engineer, Marvell
- Product Focus: 800G Coherent DSP and Beyond
Date: Monday, September 29, 2025
Time: 12:00 – 12:30 p.m. CET
Marvell Presenter: Bo Zhang, senior principal engineer
- Product Focus: Revolutionizing Rackscale Connectivity Using Co-packaged Copper & Optics
Date: Monday, September 29, 2025
Time: 4:00 – 4:30 p.m. CET
Presenters: Rohan Gandhi, product management, Switch, at Marvell, and Matthew Burns, director of technical marketing, Samtec
- Impact of Equalizer-Enhanced Phase Noise for Coherent Pluggables
Date: Thursday, October 2, 2025
Time: 9:30 – 10:00 p.m. CET
Marvell Presenter: Hai Xu, distinguished engineer
For more information visit www.marvell.com
