Indium Corporation to Feature High-Performance Thermal Management Solutions at TestConX 2026

As one of the leading providers of high-performance thermal management solutions, Indium Corporation will feature its lineup of metal thermal interface materials (TIMs) and other high-reliability products at TestConX 2026, taking place March 1-4 in Mesa, Arizona.

The company will showcase the following products:

  • Solder TIMs (sTIMs) deliver superior heat dissipation and high thermal conductance for power-dense devices exceeding 1,000 watts. Optimized for BGA package applications, they enable low-void, high-reliability performance across multiple reflow cycles, ensuring thermal stability. Unlike fluidic solutions, they ensure reliable end-of-life performance, preventing failures common with greases. Ideal for portable electronics, sTIMs enhance battery life, reduce cooling fan size, and minimize heat-sink mass while maintaining RoHS compliance and supporting sustainability initiatives.
  • Heat-Spring is a compressible, non-reflow metal TIM ideal for TIM2 applications. These indium-containing TIMs offer superior thermal conductivity over non-metals, with pure indium metal delivering 86W/mK in all planes. Because of its solid metal state, Heat-Spring avoids pump-out and bake-out problems. It also offers a sustainable solution through the company’s metals and compounds reclaim and recycle program.
  • Liquid Metal TIMs are designed to provide superior thermal conductivity for both TIM0 and TIM1 applications. They offer high thermal conductivity to enhance end-product longevity and reliability, low interfacial resistance against most surfaces to dissipate heat quickly, and extraordinary wetting ability for both metallic and nonmetallic surfaces. Liquid Metal TIMs are available in a variety of alloys, including InGa and InGaSn.
  • Phase-Change Metal Alloy (PCMA) TIMs are low-melting alloys, solid at room temperature, with a melting point as low as 30°C. They provide exceptional thermal conductivity and reliability for TIM1.5 applications, offering thermal performance similar to liquid metal. This allows for better volume control and efficient use in high-volume production. PCMA TIMs are available in Ga-based and Ga-free options.

To learn more about Indium Corporation’s thermal management solutions, visit www.indium.com or visit our experts at TestConX, booth 46.