Indium Corporation PCIM Expo 2026 – As a leading provider of high-reliability materials for all power electronics devices, Indium Corporation® will showcase its AI-enabling portfolio of products at PCIM Expo 2026, June 9-11, in Nuremberg, Germany.
The company will feature the following products:
- Formic Acid Soldering Technology (FAST) is a suite of solder materials developed for reflow under formic acid. Product offerings, including preforms, InFORMS®, and flux-free solder pastes, enable ultra-low-voiding, high-reliability solder joints with no post-reflow cleaning required, ideal for efficient manufacturing of next-generation power electronics.
- InFORMS® are reinforced solder preforms that improve mechanical strength and produce consistent bondline thickness for superior reliability performance compared to traditional solder preforms. This is a key enabler for power module applications, including package-attach to cooler, where the balance of performance and cost of ownership is critical.
- InFORCE®MF is a proven pressure Ag sinter paste designed for SiC die-attach application and is specially formulated for printing and dry-placement processes. This paste offers outstanding die shear strength, thermal conductivity, and mechanical reliability.
- InFORCE®29 is a range of pressure Cu sinter pastes for applications where high reliability and high thermal conductivity are critical. Applications for InFORCE®29 include die-attach for Si and SiC power devices and substrate-attach of power modules directly to coolers.
- InBAKE™29 is a Cu sinter paste developed for power discrete die-attach applications and for applications requiring high thermal conductivity, high electrical conductivity, and high service/operating temperatures. It is specifically designed for pressureless, batch oven sintering.
- AuLTRA® Die-Attach Preforms are a gold-based solution that offers superior quality, ensuring optimal performance in critical, high-reliability die-attach applications for power electronics devices. They adhere to strict tolerances with precise solder volumes, yielding excellent bondline thickness control, solder bonding, and thermal transfer.
- Durafuse® HT is an innovative high-temperature lead-free paste that is ideal for discrete power electronics devices. Durafuse® HT can “drop in” to the current high-Pb die-attach paste process, with no special equipment needed. Functional performance and thermal cycling reliability are both equal to or higher than those of a high-Pb solder.
To learn more about Indium Corporation’s power electronics packaging and assembly solutions, visit indium.com or meet our company experts at PCIM Expo 2026, hall 6, booth 358.
