PCIM Europe 2025
As one of the leading materials providers in the electronics assembly and solder industries, Indium Corporation is proud to feature its lineup of high-reliability products at PCIM Europe, taking place May 6-8, in Nuremberg, Germany.
Indium Corporation specializes in power device packaging, offering a portfolio of advanced material solutions encompassing the entire assembly, including die-attach, top-side die interconnect, substrate-attach, package-attach, and PCB assembly. Central to this innovation is Indium Corporation’s Fluxless Assembly Solder Technology (FAST), which provides high-reliability, flux-free soldering solutions for next-generation power electronics.
With a commitment to the full scope of power electronics applications, Indium Corporation offers the right-sized options to align with nearly every application requirement, with a focus on sustainable, energy-efficient technology solutions. The company will showcase the following among its featured products:
Pb-Free Innovations:
- Durafuse HT is an innovative Pb-free solution designed to deliver a high-temperature lead-free (HTLF) paste for discrete power electronics devices. Durafuse HT can “drop in” to the current high-Pb die-attach paste process, with no special equipment needed. Functional performance and thermal cycling reliability are both equal to or higher than a high-Pb solder.
- Indalloy 301LT for Preforms/InFORMS is a novel Pb-free alloy that enables lower reflow processing temperatures compared to SAC alloys, preventing delamination and reducing warpage in package-attach soldering applications.
Die-Attach Solutions:
- InFORCE Pressure Sinter Pastes are high-metal, low-organic content sinter materials available in both silver and copper. The benefits of a low-organic content composition include short drying for increased throughput and less volume reduction between wet and post-sintered deposits, meaning less paste can be used. The portfolio includes:
- InFORCE 29 – a range of pressure Cu sinter pastes for applications where high reliability and high thermal conductivity are critical. Applications for InFORCE 29 include die-attach for Si and SiC power devices and substrate-attach of power modules directly to coolers.
- InFORCE MF – a proven pressure Ag sinter paste designed for SiC die-attach application. InFORCE MF is specially formulated for printing and dry-placement processes. This paste offers outstanding die shear strength, thermal conductivity, and mechanical reliability.
- Award-winning InFORMS are reinforced solder preforms that improve mechanical strength and produce consistent bondline thickness for superior reliability performance compared to traditional solder preforms, particularly in power module applications.
- InTACK is a no-clean, no residue, halogen-free adhesive solution developed for holding parts in place during placement and reflow processes.
Thermal Reliability:
- Indalloy 276 is a unique lead-free solder alloy that offers a wide service temperature capability and improved reliability up to 175°C. It has demonstrated high-reliability performance while also being capable at both moderate and high service temperature conditions.
- Durafuse HR, a trusted and proven solder paste alloy technology, delivers enhanced thermal cycling performance (-40°C/125°C and -40°C/150°C) and superior voiding performance for high-reliability automotive applications. It also offers reduced solder joint cracking and increased shear strength.
To learn more about Indium Corporation’s power electronics and solder solutions, visit www.indium.com or visit our experts at PCIM Europe in hall 6, booth #358.
