KYZEN, the global leader in innovative environmentally responsible cleaning chemistries, will exhibit at the CHIPLET and Heterogeneous Integration Packaging Conference and Exhibition, or CHIPcon, scheduled to take place July 7-10 at the San Jose Marriott. KYZEN’s advanced packaging cleaning expert Scott Cain will be on-site to provide information about power module cleaning chemistries MICRONOX MX2123 and MX2127.
With the continued rise in demand for high-performance advanced packaging devices, KYZEN remains dedicated to providing cleaning chemistries like MICRONOX MX2123 and MX2127 and process optimization services to meet the array of challenges faced by manufacturers.
MICRONOX MX2123 is a balanced, multi-phase chemistry designed to remove flux residues from a wide range of IGBT module devices that utilize combinations of copper, silver and nickel DBC as substrates. It can also remove fluxes from PCBs. MX2123 can remove slight metal oxidation from base metals for post wire bond and potting processes, leaving exceptional surface conditions after cleaning. It is effective at low temperatures, in low concentrations, and is easily monitored in in-line SIA or Ultrasonic Immersion cleaning systems.
MICRONOX MX2127 is an aqueous, single-phase chemistry designed to remove lead-free solder flux residues from a variety of IGBT module devices utilizing copper and nickel DBC as substrates. MX2127 and its balanced formula successfully clean devices and leave behind surface conditions ideal for post wire bond and potting processes or shiny aluminum bond pad and DBC surfaces. It is designed to maintain a long bath life, lowering cost of ownership and to be easily monitored in in-line SIA cleaning systems.
For more than 35 years, KYZEN has prioritized innovation in the formulation and production of cleaning chemistries that effectively clean a variety of electronic devices. For more information regarding these products and the full line of MICRONOX products, visit www.kyzen.com.
