Indium Corporation, an industry leader in innovative materials solutions for semiconductor packaging and assembly, will feature its lineup of high-reliability products at the International Symposium on Microelectronics, organized by the International Microelectronics Assembly and Packaging Society (IMAPS), to be held from September 29 to October 2 in San Diego, California.
The company will showcase the following among its featured products:
- InBAKE 29 Cu sinter paste is developed for high-power die-attach applications and for applications requiring high thermal conductivity, high electrical conductivity, and high service/operating temperature. InBAKE 29 can be sintered either pressureless or with pressure, under low oxygen atmospheres of O2 <500ppm. After 4,500 TCT cycles (-40°C–175°C), the die shear strength increases
compared to time zero. Target applications include high-power die-attach (SiC MOSFET and Si IGBT), RF die-attach, and power LED die-attach. - SiPaste C312HF is a cleanable solder paste formulated for fine-aperture printing applications. This material exhibits optimum transfer efficiency with consistent printing stability after continuous use, a long stencil life of at least four hours without dry-out, and a benign, non-corrosive residue that can remain post-reflow without cleaning or be easily cleaned with semi-aqueous or saponifier technology.
- InFORCE pressure sinter pastes are high-metal, low-organic content sinter materials available in both silver and copper. The benefits of a low-organic content composition include short drying for increased throughput and less volume reduction between wet and post-sintered deposits, meaning less paste can be used. The portfolio includes:
- InFORCE 29 – a range of pressure Cu sinter pastes for applications where high reliability and high thermal conductivity are critical. Applications for InFORCE 29 include die-attach for Si and SiC power devices and substrate-attach of power modules directly to coolers.
- InFORCE MF – a proven pressure Ag sinter paste designed for SiC die-attach applications. InFORCE MF is specially formulated for printing and dry-placement processes. This paste offers outstanding die shear strength, thermal conductivity, and mechanical reliability.
- Solder TIMs deliver superior heat dissipation and high thermal conductance for power-dense devices exceeding 1,000 watts. Unlike fluidic solutions, they ensure reliable end-of-life performance, preventing failures common with greases. Ideal for portable electronics, they enhance battery life, reduce cooling fan size, and minimize heat-sink mass, all while maintaining RoHS compliance and supporting step soldering requirements.
- Durafuse HR, a trusted and proven solder paste alloy technology, delivers enhanced thermal cycling performance (-40°C/125°C and -40°C/150°C) and superior voiding performance for high-reliability automotive applications. It also offers reduced solder joint cracking and increased shear strength.
- Durafuse LT is a solder paste alloy system with versatile characteristics that enable energy savings, high reliability, and low-temperature step soldering. It is ideal for assemblies with large temperature gradients and large BGAs with complex warpage profiles. Durafuse LT delivers superior thermal cycling and drop shock performance, outperforming conventional low-temperature solders like BiSn or BiSnAg alloys, and it even outperforms SAC305 with optimal process setup.
Indium Corporation’s Formic Acid Soldering Technology (FAST) product offerings, including preforms, InFORMS, and novel solder pastes, enable high-reliability, flux-free soldering, ideal for efficient manufacturing of next-generation power electronics.
The company will also feature its tin and tin-based alloys and compounds and cold-welding solutions.
To learn more about Indium Corporation’s innovative products, visit our experts at booth 321 during the IMAPS symposium.
For more information visit www.indium.com.
