Indium Corporation Assistant Product Manager Foo Siang Hooi will deliver a technical presentation at TestConX China, to be held November 13 in Shanghai. He will focus on advancing thermal performance in high-performance computing, automotive electronics, and power semiconductor applications with an innovative thermal interface material (TIM).
The presentation, Advancing Thermal Performance: Next-Generation Pattern X–Compressible Metal TIM for Warped and Non-Planar Surfaces, will focus on Next-Generation Pattern X, which is composed of pure indium and delivers excellent thermal transfer and low contact pressure (~30psi). The novel compressible metal TIM avoids common polymer-based TIM failures, such as pump-out and bake-out, and is reworkable to provide added flexibility and cost efficiency.
“As electronic systems continue to evolve toward higher power densities and more complex packaging, compressible metal TIMs like Next-Generation Pattern X are emerging as essential solutions,” said Foo. “With its unique ability to manage thermal challenges on warped or non-planar surfaces, Next-Generation Pattern X sets a new benchmark in reliable, high-performance thermal interface design.”
As Assistant Product Manager at Indium Corporation, Foo plays a pivotal role in driving the company’s business development and expansion of engineered solder products across the Asia region. His responsibilities include delivering technical and commercial training on application technologies and products, as well as ensuring a comprehensive understanding for clients and stakeholders.
Foo earned a bachelor’s degree with honors in electronics engineering from Multimedia University in Malaysia. He is also a Six Sigma Green Belt and ISO 9000 certified.
The presentation will take place on November 13 at 4 p.m.
To learn more about Indium Corporation’s TIMs solutions, visit https://www.indium.com/products/thermal-interface-materials/.
