Indium Corporation will feature its highly versatile InFORCE series of pressure sinter paste at NEPCON Japan 2026, January 21-23, in Tokyo.
The company will showcase the following among its featured products:
- InFORCE 29 is a range of pressure Cu sinter pastes for applications where high reliability and high thermal conductivity are critical. Applications for InFORCE 29 include die-attach for Si and SiC power devices and substrate-attach of power modules directly to coolers.
- InFORCE MF is a proven pressure Ag sinter paste designed for SiC die-attach application. InFORCE MF is specially formulated for printing and dry-placement processes. This paste offers outstanding die shear strength, thermal conductivity, and mechanical reliability.
To learn more about sinter solutions, visit the Indium Corporation website, and connect with our experts at NEPCON Japan 2026, booth #E1-36.
