YINCAE Advanced Materials Co., Ltd. (YINCAE), a leading developer and manufacturer of high-performance semiconductor and electronics assembly materials, announced it will exhibit at Apex 2026, held March 16–19, 2026 at the Anaheim Convention Center.
YINCAE invites attendees to visit our Booth #4130 to explore its latest electronics assembly and packaging material solutions engineered to support higher reliability, improved process yield, and robust thermal/mechanical performance for next-generation electronic systems.
Apex brings together decision makers and technical professionals across electronics manufacturing, SMT/PCBA assembly, advanced packaging, automotive and industrial electronics, and other high-reliability applications. At Booth #4130, YINCAE will feature materials designed to address key production and performance challenges, including void reduction, thermal cycling reliability, warpage control, and high-throughput manufacturing compatibility.
YINCAE will showcase:
- Underfill Materials (Capillary & Molded Underfill / Reinforcement) designed to enhance drop performance, thermal cycling reliability, and mechanical reinforcement for advanced components and fine-pitch assemblies.
- Die Attach & Structural Adhesives engineered for high adhesion strength, temperature stability, and long-term reliability in electronics and semiconductor assembly.
- Thermal Interface Materials (TIMs) formulated to improve heat dissipation and maintain stable performance in high- power and thermally demanding designs.
- High-Reliability Assembly Materials for Advanced Electronics supporting applications in HPC/AI, automotive electronics, communications, industrial controls, and high-density packaging.
Please stop by Booth #4130 to connect with YINCAE technical experts and learn more about YINCAE’s advanced material solutions, including capillary underfills, molded underfills, die attach/structural adhesives, and thermal interface materials (TIMs) engineered for fine-pitch compatibility, no voiding, warpage control, and enhanced thermal cycling and mechanical reliability in high-density, high-power electronic systems.
For more information, please contact info@yincae.com or visit www.yincae.com.
