WE-HTO heat sinks
The WE-HTO heat sinks are designed for THT-TO packages like the TO-220 and TO-247. Here, curved sheet metal increases the surface area for heat dissipation. (Source: Würth Elektronik)

Würth Elektronik expands its product range and launches a comprehensive heat sink portfolio, divided into three specialized product groups: The WE-HTO heat sinks are designed for THT-TO packages like the TO-220 and TO-247. WE-HIC includes classic finned heat sinks for components with flat surfaces, such as CPUs or DC/DC converters. The WE-HTOI and WE-HICI variants are supplied from the factory pre-coated with thermal interface material. This eliminates the air gap between the component and the heat sink, thus maximizing cooling performance. As a special service, Würth Elektronik provides technical support, detailed heat-sink characteristics, simulation options, as well as customer-specific modifications.

WE- HIC with continuous fins for applications in which the defined airflow is clearly aligned with the fins. (Source: Würth Elektronik)

The WE-HTO heat sinks are available in various shapes and with different surface structures to enable tailored cooling performance. These include variants with curved sheet metal and with cooling fins, which dissipate more heat through their increased surface area. In addition, matching M3 screws, nuts, and insulating sleeves for mounting on the WE-HTO and WE-HTOI heat sinks can also be ordered.

Cooling fins for different airflow conditions

Cooling fins for TO components (Source: Würth Elektronik)

WE-HIC is available in two variants: with continuous and interrupted fins. The design with continuous fins is designed for applications in which the airflow is aligned with the fins. The variant with interrupted fins, however, is ideal when airflow in the installation environment cannot be clearly defined. Heat sinks for ICs are available in sizes ranging from 20 × 20 to 40 × 40 mm.

Cooling fins for diffuse airflow conditions, in the version with thermal interface material (Source: Würth Elektronik)

“We’ve been offering thermal interface materials for quite some time now, and in our design-in support for customers we always pay close attention to thermal management as well as EMC. So it’s only logical that we’re now expanding our offering to include heat sinks – after all, preventing overheating contributes to the performance and service life of components,” explains Maria Cuesta-Martin, Product Manager EMC Shielding & Thermal Materials at Würth Elektronik eiSos GmbH & Co. KG.

The heat sinks from Würth Elektronik are now available from stock without a minimum order quantity. Free samples are available on request.