Metal TIMs Solutions – Indium Corporation® Senior Area Technical Manager Leo Hu will discuss how advanced metal thermal interface materials (TIMs) can achieve new performance thresholds in next-generation electronics packaging at the Future Industries New Materials Expo (FINE) 2026, June 10-12, in Shanghai, China.
The presentation, titled Addressing Advanced Packaging Thermal Challenges: Innovations and Applications of Metal Thermal Interface Materials, will systematically showcase, through practical application cases, how TIMs performance breakthroughs can be realized through alloy composition optimization, interface structure design, and precision processes, thereby enhancing thermal efficiency and ensuring the long-term stable operation of AI and high-performance computing devices.
Leo Hu is a senior area technical manager for East China and is based at Indium Corporation’s Suzhou facility. In this role, he manages the regional technical support team and partners with the company’s global organization to provide customer product and application solutions. Hu has 20 years of experience in semiconductor packaging, specializing in advanced assembly technology development, process improvement, and assembly materials applications. He has presented multiple technical articles at global forums and academic conferences and serves as a member and reviewer for the China SMTA Technical Advisory Committee. Hu holds a master’s in integrated circuit engineering from the Institute of Computing Technology, Chinese Academy of Sciences, and a bachelor’s in science from Nankai University.
FINE 2026 visitors can attend Hu’s presentation on June 11, at 9:40 a.m. China Standard Time (UTC+8). To learn more about Indium Corporation’s complete portfolio of TIMs solutions, visit indium.com.
For more information visit: www.indium.com
