Rohde & Schwarz verifies Next Generation eCall for EN 17240:2024 Standard
R&S NG eCall Verification:
Rohde & Schwarz, a global leader in test and measurement solutions announced its work...
Vishay Intertechnology RGB LED in PLCC-6 Package Provides Independent Control of Red, Green, and...
Automotive Grade RGB LED in PLCC-6 Package:
Vishay Intertechnology, Inc. introduced a new tricolor LED that provides luminous...
Nexperia brings the benefits of clip-bonded FlatPower packaging to bipolar junction transistors
MJPE-Series BJTs in Compact CFP15B Package:
Nexperia announced the expansion of its bipolar junction transistor (BJTs) portfolio by...
Fujitsu Data Intelligence PaaS enhances Mazda’s data-utilization and decision-making
Fujitsu Limited announced that Japanese multinational automotive manufacturer Mazda Motor Corporation has commenced full-scale operation of "Fujitsu Data Intelligence PaaS." Mazda will...
New at Mouser: Nexperia PESD1ETH10L-Q and PESD1ETH10LS-Q ESD Protection for Automotive and EV Applications
PESD1ETH10L-Q and PESD1ETH10LS-Q ESD Protection Diodes:
Mouser Electronics, Inc., the authorized global distributor with the newest electronic components...
Empowering Women Through Skilling: Hero MotoCorp and ASDC Host Saksham Convocation and New Batch...
Saksham Project:
A milestone event was held yesterday in Vaishali (Hajipur), Bihar, to mark the convocation of trained women...
Future Electronics Unveils the Latest Expert Panel Series Article on Radar, LiDAR, and Machine...
Future Electronics, a global leader in electronic components distribution, is announcing the release of the newest installment in its Expert Panel Series,...
NXP Completes Acquisition of TTTech Auto to Accelerate the Transformation to Software-Defined Vehicles
NXP Semiconductors N.V. announced the completion of the acquisition of TTTech Auto , a leader in innovating unique safety-critical systems and middleware for software-defined...
TDK expands thin-film power inductors for automotive applications to higher currents
TDK Thin-Film Power Inductors:
TDK Corporation has expanded its TFM201612BLEA series (2.0 x 1.6 x 1.2 mm –...
Microchip Partners with Nippon Chemi-Con and NetVision on First ASA-ML Camera Development Ecosystem for Japanese...
An automotive industry transition is underway to replace proprietary camera connectivity with solutions based on the open and interoperable Automotive Serdes Alliance...
