Hitachi: Established the Open Source Program Office (OSPO) to Globally Lead the Strategic Utilization...
Hitachi, Ltd. ("Hitachi") has established the Open Source Program Office (Hitachi OSPO) to globally lead the strategic utilization of OSS in the...
ITC’s Final Decision Confirms Innoscience’s Customers Remain Unaffected by the Innoscience-EPC Patent Row
Highlights:
Finds No Infringement of the '508 Patent
and Paves the Way for Designing...
Indium Corporation Receives Global Technology Award at SMTA International
Indium Corporation was honored with a Global Technology Award during an award ceremony on October 22, 2024, at SMTA International in Rosemont, Illinois. The company...
PEMTRON Wins Dual Awards at NEPCON Asia for Revolutionary D2 System
PEMTRON, an inspection equipment developer and supplier, is proud to announce that its D2 System has received two prestigious honors at Nepcon...
Würth Elektronik at Heilbronn Slush’D 2024
The Würth Elektronik eiSos Group, manufacturer of electronic and electromechanical components, has positioned itself as a technology promoter at Slush'D in Heilbronn,...
Exxelia Expands in India with Acquisition of SVM, Enhancing Magnetics and Busbar Offerings for...
Exxelia, a leading designer and manufacturer of high-performance passive components and sub-systems, announces the acquisition of 70% of SVM Private Limited, a...
SCS Expands PrecisionCure UVC (MUV) Line with Two Size Options for Enhanced UV Curing...
Specialty Coating Systems (SCS) is pleased to announce the PrecisionCure UVC microwave UV curing system is now available in two sizes —...
Smith Secures Automotive Award at IIC Shenzhen 2024
Smith, a leading global distributor of electronic components and semiconductors, today announces that it has been named Outstanding Performance Component Distributor: Automotive Electronics at...
STMicroelectronics and ENGIE sign long-term agreement for the supply of electricity produced from renewable...
Highlights:
21-year contract for energy produced by a new solar farm in Malaysia, where ST operates a...
ESSCI Signs MoU with Pamulapati Butchi Naidu College to Launch Apprenticeship Embedded Degree Program
Electronics Sector Skills Council of India (ESSCI) has signed a Memorandum of Understanding (MoU) with Pamulapati Butchi Naidu College, marking a significant...
