Kurtz Ersa Inc. Announces Strategic Partnership with Interflux Singapore PTE for Cutting-Edge Fluxing Technology
Kurtz Ersa Inc., a leading supplier of electronics production equipment, is pleased to announce its new partnership with Interflux Singapore PTE. This...
Silicon Labs Series 3 Platform Guides the Evolution of the IoT
Silicon Labs, a leader in secure, intelligent wireless technology for a more connected world, delivered the opening keynote for the inaugural embedded...
transcosmos develops “trans-AI Annotator,” data labeling solution in South Korea
transcosmos is proud to announce that the company has developed "trans-AI Annotator," its proprietary AI data labelling solution in South Korea. The...
CE3S Offers Precision Inspection and Visualization Solutions for Enhanced Quality Control
Cumberland Electronics Strategic Supply Solutions (CE3S), your strategic sourcing, professional solutions and distribution partner, is proud to offer advanced Inspection and Visualization...
Unveiling the Future of Connectivity: The Cellular IoT Module Type 1SC-SFS
Manufacturing Co., Ltd. (hereinafter “Murata”) is excited to announce the launch of its latest innovation, the Cellular IoT Module Type 1SC-SFS (LBAD0XX1SC-151)....
Fujitsu leverages data to secure stable and efficient power supply for Kansai Transmission and...
Fujitsu announced that it is developing a system based on “Fujitsu Data Intelligence PaaS” to realize a stable and efficient power supply...
VIAVI Announces Opening of VIAVI Automated Lab-as-a-Service (VALOR) Open RAN Testing Facility
VIAVI Solutions has opened its VIAVI Automated Lab-as-a-Service (VALOR) Open RAN testing facility in Chandler, Arizona. Funded by a grant from the...
Murata’s Type 1SC-NTN module achieves Skylo U.S. certification for cellular and non-terrestrial network connectivity
Murata announced that its Type 1SC-NTN has received Skylo U.S. certification for its dual-mode cellular and non-terrestrial network (NTN) capabilities, making it...
Ericsson launches ‘EricssonEdge Academia Program’ to develop young telecom talent
Ericsson, a global leader in telecommunications, announced the launch of the 'EricssonEdge Academia Program' that aims to revolutionize early career talent development...
Amkor and TSMC to Expand Partnership and Collaborate on Advanced Packaging in Arizona
Amkor Technology and TSMC announced that the two companies have signed a memorandum of understanding to collaborate and bring advanced packaging and test capabilities to...
