Electronicsmedia

DigiKey, the global distribution leader of electronic components and automation products, is pleased to announce the winners of the ElectronicWings IoT + AI Project Design Challenge 2025. Makers and students in India were invited to submit their innovative IoT- and AI-focused ideas for a chance to win their share of prizes and boards worth ₹6,00,000 to help...

NEC CDI Solution: NEC Corporation announced the launch of its "NEC Composable Disaggregated Infrastructure Solution" in Japan, enabling flexible and distributed deployment of computing resources such as servers and GPUs. This solution aims to reduce capital investment and operating costs for data centers and research institutions, while also promoting energy efficiency, by leveraging...

Anglia Components, in conjunction with its leading supplier franchise base, now offers design engineers one of the fastest and most comprehensive NPI programmes in the industry. Anglia aims to get NPI's onto its Anglia Live e-commerce platform within 48 hours of release by the manufacturer, and to have samples available free of charge, enabling customers to differentiate their next...

PAN1783/A Bluetooth 5.4 LE Modules: Mouser Electronics, Inc., the industry's leading New Product Introduction (NPI) distributor with the widest selection of semiconductors and electronic components, is now stocking the PAN1783 and PAN1783A Bluetooth 5.4 LE wireless modules from Panasonic. Based on the nRF5340 system-on-chip (SOC) by Nordic Semiconductor, the PAN1783 and PAN1783A modules...

PEMTRON Inspection Solutions at NEPCON Japan: PEMTRON, an inspection equipment developer and supplier, will exhibit at NEPCON Japan, taking place January 21–23. On display in Booth #E15-8 will be PEMTRON’s comprehensive inspection lineup, including the SATURN 3D SPI, ATHENA 3D AOI, JUPITER AXI, and ZEUS semiconductor packaging inspection system, highlighting inspection speed, accuracy,...

Kurtz Ersa Inc., a leading supplier of electronics production equipment, will offer two back-to-back VERSAFLOW 3 training courses at its U.S. headquarters in Plymouth, Wisconsin, from January 26–30, 2026. The first course, VERSAFLOW 3 – Level II Maintenance Training, will run January 26–28. This hands-on session is designed to equip participants with the knowledge...

Indium Corporation will feature its formic acid soldering technologies (FAST) product series at NEPCON Japan 2026, taking place January 21-23, in Tokyo. The company will feature various solutions ideal for power device packaging, ranging from pastes, solders, and tracking agents. InFORMS are reinforced solder preforms that improve mechanical strength and produce consistent bondline thickness for superior...

Indium Corporation will feature its highly versatile InFORCE series of pressure sinter paste at NEPCON Japan 2026, January 21-23, in Tokyo. The company will showcase the following among its featured products: InFORCE 29 is a range of pressure Cu sinter pastes for applications where high reliability and high thermal conductivity are critical. Applications for InFORCE 29...

As the need for security becomes increasingly more critical, MIPI Alliance has continued to broaden its portfolio of standardized solutions, adding two more specifications in late 2025, and continuing work on significant updates to the MIPI Camera Security Framework specifications slated for completion in mid-2026. Read on to learn more about the newly released specifications and...

Key Highlights: Synopsys further focuses its IP resources and roadmap on extending leadership in interface and foundation IP while pursuing highest-value, AI-driven opportunities from cloud to edge. Transaction underscores Synopsys' commitment to disciplined portfolio management while capturing highest growth engineering solutions from silicon to systems. Synopsys...