Electronicsmedia

Mouser Electronics, Inc., the authorized global distributor with the newest electronic components and industrial automation products, is now stocking the PowerWize 3.40mm interconnects from Molex. The PowerWize connectors use advanced COEUR socket technology to deliver the power efficiency required for effective cost management. The PowerWize 3.40mm Interconnects cater to the demands of modern high-power industrial automation, telecommunications,...

Hitachi, Ltd. ("Hitachi") introduced HMAX by Hitachi at CES 2026. HMAX by Hitachi is a suite of next-generation solutions that brings the power of AI to social infrastructure. By harnessing vast data from physical and digital assets, integrating advanced AI, and applying Hitachi’s unmatched domain expertise, HMAX tackles the most complex social infrastructure challenges—maximizing outcomes and value...

Solid State Disks Limited (SSDL) is pleased to announce that Systems Engineering & Assessment Ltd (SEA) has taken delivery of its 130th FLOPPYFlash drive, needed to upgrade the Outfit DLH decoy launch systems fitted to the UK Royal Navy's fleet of Type 23 frigates. The Outfit DLH system entered service more than 20 years ago and...

congatec– a leading vendor of embedded and edge building blocks – launched the industry’s broadest portfolio of Computer-on-Modules (COMs) based on Intel Core Ultra Series 3 processors . The new high-performance modules deliver up to 180 TOPS of power-efficient computation designed for next-level AI acceleration. In most scenarios, the modules' high level of processing capability means discrete...

Marvell Technology, Inc., a leader in data infrastructure semiconductor solutions, announced it has entered into a definitive agreement to acquire XConn Technologies (“XConn”), a provider of advanced PCIe and CXL switching silicon. The acquisition expands Marvell’s switching portfolio by adding XConn’s PCIe and CXL products and augments Marvell’s Ultra Accelerator Link (“UALink”) scale-up switch team, adding highly...

Digid nanoscale sensors: Patented printed electronics technology enables a sensor which is just 1µm long to be deposited on silicon, metal, polymer and other materials Digid's nanoscale technology promises a revolution in pervasive sensing in surgical equipment, humanoid robots, biosensing and many other applications

Following the unveiling of the new Intel Core Ultra Series 3 processors (formerly Panther Lake) at CES, AAEON's UP brand has announced its development timeline for the UP Xtreme PTL Edge, an AI Mini PC leveraging the platform. Expected to enter mass production during the latter part of Q1, the UP Xtreme PTL Edge...

Hyundai Mobis Qualcomm SDV agreement: MOU signed at CES 2026 to co-develop integrated solutions for automotive tailored to emerging markets. Hyundai Mobis to enhance performance, efficiency, and stability for advanced driver assistance systems using the Snapdragon Ride Flex system-on-chip. Companies’ agreement extends beyond ADAS development, with plans to deliver broader SDV solutions based on Snapdragon automotive technologies.

SMTA Pan Pac 2026: Indium Corporation Senior Technologist Ronald Lasky, Ph.D., P.E., will be among the presenters at the SMTA Pan Pacific Strategic Electronics Symposium (Pan Pac) taking place in Hawaii, February 2-5. Dr. Lasky’s presentation, The Electron: A Biography, will examine the birth of the electron and how various discoveries have shaped the history...

Silanna-Avnet Distribution Partnership: Silanna Semiconductor, a global leader in analog innovation, announced a strategic franchise agreement with Avnet. Under the terms of the deal, Avnet will market, distribute and provide technical design support for Silanna Semiconductor's complete family of products to engineering teams in the Americas. The agreement is effectively...