Electronicsmedia

Hollow Core Fiber Testing and Certification Solution: Proven platform implements proprietary HCF-specific algorithms for OTDR, dispersion testing and attenuation profiling Solution has been validated in trials with three leading hyperscalers VIAVI Solutions Inc. (VIAVI) has announced the industry's first all-in-one medium and long-range bidirectional...

Calterah, a global leader in chip design for CMOS single-chip millimeter-wave radar sensors, together with Rohde & Schwarz, a world-leading company in test and measurement, has successfully demonstrated its next-generation solution for digital car keys based on the Dubhe-UWB-SoC chip (Ultra-Wideband; System-on-Chip). This is the world’s first UWB chip to fully comply with the new IEEE 802.15.4ab...

Tura Automotive-Qualified Thermal Camera: Teledyne FLIR OEM, a Teledyne Technologies Incorporated company, announced the launch of Tura, the first Automotive Safety Integrity Level (ASIL-B) thermal longwave infrared (LWIR) camera developed in compliance with ISO 26262 functional safety (FuSa) standards. Tura is purpose-built to meet the stringent perception requirements for vehicle-based night vision, advanced driver-assistance...

News Summary: NVIDIA is the first to release an open reasoning VLA model designed to tackle long-tail autonomous driving challenges; NVIDIA Alpamayo family also includes simulation tools and datasets for AV development. Alpamayo 1, AlpaSim and Physical AI Open Datasets enable the development of vehicles that perceive, reason and...

OMNIVISION Image Sensors with TheiaCel Technology: OMNIVISION, a leading global developer of semiconductor technology, including advanced digital imaging, analog and display solutions, announced that two of its CMOS image sensors with TheiaCel technology, the 8-megapixel (MP) resolution OX08D10 and the 3-MP resolution OX03H10, are supported on the NVIDIA DRIVE AGX Hyperion autonomous vehicle platform. NVIDIA DRIVE AGX...

BMI423 IMU: Extended measurement range of ±32 g and ±4000 dps enables precise tracking of fast, dynamic motion Voice Activity Detection (VAD) via bone conduction conserves power and enhances privacy Low current consumption of only 25 µA for "always-on" acceleration-based applications in compact devices

BMI5 Motion Sensor Platform: Three high-performance variants for next-generation devices: BMI560: optimized for Extended Reality (XR) headsets, glasses and advanced Optical Image Stabilization (OIS+) in smartphones and action cams BMI563: extended-range for high-dynamic motion sensing for robotics and XR controllers BMI570: precise activity and context...

At the Consumer Electronics Show (CES 2026), Sandisk announced SANDISK Optimus as the new name for its renowned internal SSD lineup for gamers, creators, and professionals. The new branding for this family of products reflects a focus on performance leadership, engineering excellence, and a heritage of trust in flash memory. The powerful collection of SANDISK Optimus internal storage solutions, encompasses...

element14 is now distributing connectivity solutions from Digi International, a leading global provider of Internet of Things (IoT) connectivity products, services, and solutions. The new relationship is an expansion of Avnet’s existing relationship with Digi and will enhance element14’s wireless communications portfolio. It will also enable Digi to utilise the “power of one,” which...

YINCAE Advanced Materials, a leading supplier of high-performance materials for advanced semiconductor packaging, will showcase its latest wafer-level packaging solutions at the Wafer-Level Packaging Symposium, taking place February 17–19, 2026, in San Francisco, California, USA. At the event, YINCAE will highlight TM 150LM liquid metal thermal interface material in combination with LA 150 rubber...