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onsemi to Develop Next-Generation GaN Power Devices with GlobalFoundries

GaN Power Devices
Next-Generation GaN Power Devices: News Highlights: onsemi collaborates with GlobalFoundries to develop state-of-the-art 200mm eMode lateral GaN-on-Silicon process technology for critical markets, starting with 650V. onsemi’s GaN portfolio is ideally suited for high-density systems where power demands continue to rise but physical size cannot, including...

NXP EasyEVSE Platform Wins the Prestigious Green Mobility Award

Green Mobility Award
We are excited to announce that NXP’s EasyEVSE Development Platform has been honored with the Green Mobility Award at the prestigious Automotive Today event in Bucharest. This award recognizes and celebrates innovation and sustainability in the mobility sector. This award is dedicated to acknowledging the solutions that measurably reduce environmental impact and advance responsible, circular mobility practices...

FormFactor Expands Silicon Photonics Test Capabilities With Acquisition of Keystone Photonics

Silicon Photonics
FormFactor, Inc., a leading semiconductor test and measurement supplier, announced the acquisition of Keystone Photonics, a pioneer in optical probing technology for silicon photonics (SiPh) and co-packaged optics (CPO) wafer testing. These technologies are key for next-generation data centers powering AI and high-performance computing – accelerating data communications to handle massive information loads with dramatically lower power...

SK keyfoundry, Accelerates Development of SiC-Based Compound Power Semiconductor Technology

SK keyfoundry
SK keyfoundry, announced that it is accelerating the development of SiC (Silicon Carbide)-based compound power semiconductor technology, bolstering its efforts into the global power semiconductor market. Leveraging its advanced manufacturing expertise and extensive intellectual property (IP) portfolio across the semiconductor manufacturing process, the company has recently acquired SK powertech, a key player with core competencies in the...

Pusan National University Researchers Uncover Scalable Method for Ultrahigh-Resolution Quantum Dot Displays

Ultrahigh-Resolution Quantum Dot Displays Colloidal quantum dot (QD) light-emitting diodes have great potential in display applications. However, their commercialization remains a challenge due to the difficulty in achieving high-resolution patterning of QDs without degrading their optical properties. To address this, researchers have developed a nondestructive method for ultrahigh-resolution QD patterning. By blending QDs with...

Fujitsu Develops Fujitsu Kozuchi Physical AI 1.0 for Seamless Integration of Physical and Agentic AI

Fujitsu Kozuchi Physical AI 1.0
Fujitsu announced the development of Fujitsu Kozuchi Physical AI 1.0, a new technology designed to seamlessly integrate physical and agentic AI. The technology, which marks the first achievement of Fujitsu's collaboration with NVIDIA, announced on October 3, 2025, integrates NVIDIA’s software stack with Fujitsu's proprietary technologies. As core functions offered through the new technology,...

Simplicity Wins—Part 1: A Deeper Look into Active Balancing on BMS

Active Balancing in BMS
Abstract Simplicity and efficiency—even if not the shared pursuit of all designers—are the goals for most. Following the principle that simplicity wins, this article delves into and explores the design prototype of a simple yet efficient active balancing system for battery management systems (BMS). Introduction Still think that...

STEVAL-ROBKIT1: A 1st robotics eval kit for some, but a stepping stone to embedded systems for many

STEVAL-ROBKIT1
The STEVAL-ROBKIT1 is our first “ready-to-go” evaluation kit for robotics applications, designed for traditional engineering teams and educational purposes, thereby lowering the barrier to entry for what is often thought of as a complex subject. It comes with three boards: a central system, a motor-control PCB, and a camera module, together with a robotic frame, wheels, and motors with encoders....

DENSO Signs Joint Development Agreement with MediaTek for Automotive SoC

DENSO MediaTek partnership for SoC development
DENSO CORPORATION announced that on October 31, 2025, it signed a joint development agreement with MediaTek Inc. (hereinafter "MediaTek"), a leading semiconductor design company, to accelerate the development of next-generation automotive system-on-chips (SoCs). As automotive systems become increasingly intelligent and spur advancements in autonomous driving and vehicle connectivity, the importance of automotive SoCs as...

How to Use Compact PLCs to Get Big Results in Green Energy, Building Automation, and Industrial Systems

Compact PLCs
Industrial network designers are being pressed to integrate traditional programmable logic controller (PLC) and industrial Internet of Things (IIoT) technologies in cramped spaces to support high performance in smaller automation and digitalization projects. The controller must be compact but still able to bridge traditional automation with the IIoT and integrate information technology (IT) and...

Interview