Electronicsmedia

SiC Power Design Webinar: Mouser Electronics, Inc., the authorised global distributor with the newest semiconductors and electronic components, has partnered with Infineon Technologies to provide the engineering community with a new webinar titled "Breaking Voltage Barriers: Enabling Compact, Efficient Designs with High Voltage Discretes". This free-of-charge webinar will take place on 24 June 2025 at...

Ensign InfoSecurity (“Ensign”), one of Asia’s largest cybersecurity service providers, has won the “Product Excellence - Cybersecurity Product of the Year” award at the Tech Fest Hong Kong Awards 2025 for its proprietary solution, Aletheia, an AI-powered real-time deepfake detection tool that enhances digital trust and protects organisations against multimedia-based deception. Developed by Ensign...

Quantum Computing Innovations Quantum computing is igniting a technological revolution, poised to solve challenges beyond the reach of classical systems—from pioneering aerospace materials to optimizing global supply chains. Building these groundbreaking systems demands precision manufacturing for advanced components that drive quantum performance, from sophisticated control electronics to cutting-edge radio frequency (RF) technologies.

Xiamen Hongfa Electroacoustic Co., Ltd (Hongfa) has designed the industry’s highest performance and smallest active suspension power system with a goal to drive what has been a long-time luxury feature into the midrange vehicle class. Overcoming decades of false starts by prominent automotive technology providers, Hongfa struck a balance between the need to manage active suspension system...

FCU3501 Embedded Computer The Forlinx Embedded FCU3501 Embedded Computer is developed based on the Rockchip RK3588 processor, featuring a 4×Cortex-A76 + 4×Cortex-A55 architecture, with the A76 cores running at up to 2.4GHz and the A55 cores at up to 1.8GHz. It supports 8K video encoding and decoding and integrates a 6 TOPS NPU for AI acceleration. The...

High-reliability antennas The relentless ascent of Artificial Intelligence (AI) as a transformative force has brought an unprecedented demand for dependable connectivity. As AI evolves into the powerhouse we know it to be, the necessity for unwavering and reliable data flow has never been more critical. When we examine the potential sources of interference...

800V HVDC AI Data Center Power Texas Instruments (TI) announced it is working with NVIDIA in the development of power management and sensing technologies for 800V high-voltage direct current (HVDC) power distribution systems for data center servers. The new power architecture paves the way for more scalable and reliable next-generation AI data centers.

Analogue Front End (AFE) in Smart Manufacturing Modern smart technology depends on data. Whether connecting the operations of a smart factory or enabling the latest self-guided vehicles, these technologies rely on the feedback of an array of sensors. The information they collect creates an accurate picture of the world around them. Machines can...

Infineon Technologies AG will supply Rivian’s R2 platform with power modules for traction inverters. The R2 platform will use silicon carbide (SiC) and silicon (Si) modules from Infineon’s HybridPACK Drive G2 family. Supply is expected to start in 2026. Additionally, Infineon will supply other products for the platform, including AURIX TC3x microcontrollers and OPTIREG power management ICs.

Infineon Technologies AG has joined the board of directors of FiRa (fine-ranging) Consortium. This marks a significant step in the company’s commitment to further shaping the future of Ultra-wideband (UWB) across a wide field of use cases and verticals. Having been an active contributor to FiRa since 2021, Infineon is now expanding its activities at the board level...