Electronicsmedia | India's Leading Core Electronics and Technology Publication | Page 133

Asahi Kasei Receives 2025 TSMC Excellent Performance Award in Recognition of Its PIMEL Photosensitive Dielectric for Advanced Packaging Material

TSMC Excellent Performance Award
Asahi Kasei received a 2025 TSMC Excellent Performance Award for "Excellent Technology Development and Production Support" in Advanced Packaging materials at the 2025 Supply Chain Management Forum held by Taiwan Semiconductor Manufacturing Co., Ltd. on November 25, 2025. The award recognizes suppliers for their outstanding performance in the development of innovative technologies and production...

Renesas Releases its First Wi-Fi 6 and Wi-Fi/Bluetooth LE Combo MCUs for IoT and Connected Home Applications

MCUs
Renesas Electronics Corporation, a premier supplier of advanced semiconductor solutions, introduced the RA6W1 dual-band Wi-Fi 6 wireless microcontroller (MCU), along with the RA6W2 MCU that integrates both Wi-Fi 6 and Bluetooth Low Energy (LE) technologies. These connectivity devices address the growing demand for always-connected, ultra-low-power IoT devices across smart home, industrial, medical and consumer applications. Renesas also launched...

Vishay Introduces New AEC-Q200 Qualified, Glass Protected NTC Thermistor in 0402 Case Size

NTC Thermistor
Vishay Intertechnology, Inc. introduced a new AEC-Q200 qualified, glass protected NTC thermistor in the widely used 0.5 mm by 0.5 mm by 1 mm 0402 case size. The Vishay BCcomponents NTCS0402E3104*XT combines a high beta (B25/85) value of 4311 K with an electrical resistance value at +25 °C (R25) of 100 kΩ. Fully glass...

element14 launches The DevKit HQ for embedded evaluation boards, kits, and tools

DevKit HQ
element14, has launched The DevKit HQ, a new online resource that brings together evaluation boards, development kits, single board computers (SBCs), tools and technical documents in one place. A recent survey of engineering professionals found that finding the right development kit is a big challenge, with many engineers relying on kits to explore new...

Tejas Networks emerges as a leading supplier of IP Routing products across the country for BharatNet Phase III packages

Tejas Networks
Tejas Networks announced that the company has been awarded IP Routing equipment purchase contracts for 7 of the 12 BharatNet Phase-III packages announced till date, thereby emerging as the largest supplier by the number of packages. BharatNet is a flagship program by the Government of India that seeks to create a transformative impact in...

Rohde & Schwarz presents world’s first RF power sensor with 0.80 mm RF connector for gapless DC to 150 GHz coverage

R&S NRP150T
Equipped with a next generation high-performance coaxial 0.80 mm RF connector supporting frequencies up to 150 GHz, the new R&S NRP150T thermal power sensor provides the world’s widest non-banded frequency range of any commercially available RF power sensor. It unlocks new applications in high-frequency power measurement, including upcoming automotive radar bands. In addition, the new wideband power...

StudentZone—ADALM2000 Activity: An Ohm’s Law Experiment

ADALM2000 Activity
Objective This lab activity demonstrates and defines how electrical charge relates to voltage, current, and resistance. It introduces Ohm’s law and how to use it to understand electricity along with a simple experiment to demonstrate these concepts. Electricity Basics When beginning to explore electricity and electrical engineering, it...

WBA Industry Report 2026 Finds 62% of Survey Respondents More Confident to Invest in Wi-Fi Than 12 Months Ago

WBA Industry Report 2026
WBA Industry Report 2026: 60% see converged Wi-Fi and 5G as key to enterprise flexibility and that both will co-exist 38% plan to roll out Wi-Fi 7 in 2025/2026, while 65% say 6 GHz availability is important or critical to their Wi-Fi business 32% plan...

R&D Advances for the FAMES Pilot Line: 400 °C CMOS Breakthrough Opens Critical Doors to 3D Integration Goals

CEA-Leti
CEA-Leti, the coordinator of the FAMES Pilot line, has achieved a major milestone for next-generation chip stacking: fully functional 2.5 V SOI CMOS devices fabricated at 400 °C. The devices match electrical performance of devices fabricated at standard thermal budget (>1000 °C), removing one of the last barriers to large-scale 3D sequential integration (3DSI) —a core objective of FAMES.

Amphenol RF Introduces Eco-Friendly PFAS-Free SMA Connectors and Adapters

PFAS-free SMA connectors and adapters
Amphenol RF is pleased to announce the introduction of a line of PFAS-free SMA connectors and adapters, expanding our industry-leading portfolio of high-performance RF interconnect solutions. These products are engineered from PEEK (polyether ether ketone) as a PFAS-free alternative to PTFE, offering an environmentally responsible solution without compromising performance. This innovative product line provides...

Interview