Indium Corporation Expert to Present on Advancements in Bi-free In-containing Lower-Temperature Solder at ICEE 2025
Indium Corporation’s Senior R&D Manager of the Alloy Group, Hongwen Zhang, Ph.D., will present on the company’s award-winning Durafuse Technology during the IEEE International Conference on Emerging Electronics (ICEE), December 13–16, in Bengaluru, India.
Dr. Zhang’s presentation, A Review on a Bi-free In-containing Lower-Temperature Solder, will discuss how Durafuse LT, a Bi-free, In-containing low-temperature solder paste, is a robust alternative to...
CEA-Leti & STMicroelectronics’ Paper at IEDM 2025 Demonstrates Path to Fully Monolithic Silicon RF Front-Ends with 3D Sequential Integration
CEA-Leti and STMicroelectronics presented results at IEDM 2025 showcasing key enablers for a new high-performance and versatile RF Si platform cointegrating best-in-class active and passive devices used in RF and Optical FEM. Their paper details 3D sequential integration of silicon-germanium (SiGe) heterojunction bipolar transistors (HBT), RF SOI switches, and high-quality passives on a single wafer—opening a path to...
Marvell Launches Strategic Initiative to Accelerate AEC Ecosystem and Hyperscaler Adoption
Marvell Technology, Inc., a leader in data infrastructure semiconductor solutions, introduced its Golden Cable initiative, a strategic program designed to accelerate and broaden the active electrical cable (AEC) ecosystem and enable faster time-to-market for hyperscaler AI deployments. The program delivers a complete offering with industry-leading software, validated reference designs and comprehensive support, empowering ecosystem partners to quickly design...
How India Is Slowly Building Its Own Chip Factories for the Future?
Introduction: Phones, cars, laptops, TVs—everything we use in our daily lives—all rely on semiconductor chips. For many years, India had to import almost all semiconductor chips from other countries, but now India is building its own chip factories. This process may be slow, but its direction is very clear: India has to become self-reliant in chip manufacturing.
How Health & Safety IoT Devices Are Becoming Part of Daily Life ?
Health & Safety IoT Devices:
Technology is changing, but the most interesting thing is that now small devices have started taking care of our health and safety. People stay busy these days, so having a gadget that works quietly without asking for attention becomes very helpful. This is why IoT health & safety...
Top Ways to Use AI to Save Time on Presentation Workflows
Creating presentations from scratch can take hours, time that many professionals simply don’t have. From outlining content to designing slides, the process can slow down productivity and shift focus away from more strategic work. That’s why more and more professionals are turning to AI for presentation creation. These smart solutions transform rough ideas or written content into...
PCIM Asia New Delhi Conference opens today, powering India’s next leap in power electronics
PCIM Asia New Delhi Conference 2025:
The PCIM Asia New Delhi Conference - India’s new meeting ground for the global power electronics community- commenced today, marking its debut edition in the country. Bringing together industry experts and leading academic researchers, the conference sets the stage for breakthroughs in next-generation power electronics. As the...
u-blox introduces JODY-B1, the automotive Bluetooth module enabling multiple simultaneous connections
u-blox, a global leader in positioning and short-range communication technologies for automotive, industrial and consumer markets, announced JODY-B1, an automotive-qualified Bluetooth module capable of maintaining multiple simultaneous Bluetooth Dual-Mode (Classic + LE) connections.
As vehicles evolve into connected entertainment spaces, passengers increasingly expect individual control over their in-car audio and gaming experiences. While traditional...
New incremental encoder IERF3 L from FAULHABER
FAULHABER is expanding its product range with the ultra-precise incremental encoder IERF3 L. Thanks to the optical measuring principle and state-of-the-art chip technology, the device offers the highest resolution, excellent repeatability, and outstanding signal quality. In typical applications, the positioning accuracy is 0.1° and the repeatability 0.007°. This makes the encoder the perfect solution for high-precision positioning...
AAEON’s UP Brand Partners with DEEPX to Deliver Ultra-Efficient AI Performance Across Hardware Platforms
AAEON's UP brand, a leading designer and manufacturer of industrial development boards, announced its collaboration with DEEPX, a pioneer in producing power-efficient yet sophisticated AI acceleration modules.
The partnership will see multiple models from UP’s Development Kit and Mini PC series utilize DEEPX’s innovative DX-M1 AI chip to satisfy market demand for ultra-low power,...

















