Electronicsmedia

Webinar: The oHFM (Open Harmonized FPGA Module) standard defines the world’s first open, unified architecture for FPGA System on Modules (SoMs). In this webinar, we will introduce the oHFM specification developed by SGeT, including its two variants oHFM.c (connector-based) and oHFM.s (solderable). We will also highlight essential design considerations such as power architecture, clocking,...

Ceramic Antennas Market: In 2026, the demand for compact, high-efficiency wireless components continues to accelerate across IoT, automotive, and consumer electronics. According to insights published by Dataintelo, ceramic antennas are emerging as a critical technology due to their reliability, miniaturization capabilities, and consistent performance in high-frequency environments. This article explores the ceramic antennas landscape...

Convergence India 2026 & Smart Future Cities India Expo 2026: The expo will host over 1,000 participants and 50,000 attendees, showcasing advancements in AI, 6G, fintech, semiconductors, and smart urban solutions. Co-located expos include AI Bharat, FinTech India, IoT India, Smart Mobility India and Startup Hub, which will...

AAEON, a leading producer of AI and networking platforms, will present a range of new products at the Upperside World Congress from March 24th – 26th, 2026. Date: March 24 – 26, 2026Booth: 306Venue: Palais des Congrès de Paris, Paris, France  Register here with the promo code 30620UWCP6BR for a 20% discount...

Indium Corporation Senior Area Technical Manager Leo Hu will discuss how innovative interconnect materials can drive higher yields and reliability in semiconductor packaging processes at the International Electronic Circuit Exhibition (CPCA), taking place March 24-26 in Shanghai, China. The presentation, titled Co-innovation of Materials and Processes for Advanced Semiconductor Packaging, details how product innovations...

Wireless Antennas Market: Wireless antennas are the backbone of modern electronic devices, enabling seamless connectivity across smartphones, IoT systems, vehicles, and industrial equipment. The rapid expansion of connected ecosystems between 2021 and 2026 has significantly transformed antenna design, efficiency, and deployment. According to recent industry analysis by Dataintelo in 2026,...

Productronica China 2026: As a proven leader in soldering materials and metal thermal interface materials (TIMs) solutions for future-forward technologies, Indium Corporation will showcase its AI-enabling product portfolio at Productronica China, March 25-27, in Shanghai, China. The company will feature the following products: Solder TIMs...

Microchip Technology announces its BZPACK mSiC power modules, designed to meet stringent High Humidity High Voltage High Temperature Reverse Bias (HV‑H3TRB) standards. The BZPACK modules can deliver exceptional reliability, streamline manufacturing and offer versatile system‑integration options for the most demanding power‑conversion environments. Available in a wide range of topologies, including half bridge, full bridge, three-phase and PIM/CIB configurations, providing...

The global mobility landscape is undergoing a seismic shift and electric scooters are at the epicentre of it. Amid soaring fuel prices, worsening urban congestion, and an accelerating climate crisis, two-wheeled electric vehicles have moved from novelty to necessity. According to the latest findings in the Electric Scooter Market report by Polaris Market Research, the sector was valued at USD...

The global Event Security market is experiencing accelerated growth, fueled by rising security threats, increasing event sizes, and stricter regulatory frameworks. According to data published by Marketintelo, the market was valued at USD 32.8 billion in 2023 and is projected to reach USD 78.6 billion by 2032, expanding at a compound annual growth rate (CAGR) of 12.4%.