Electronicsmedia

Breaking through a technological roadblock that has long limited efficient edge-AI learning, a team of French scientists developed the first hybrid memory technology to support adaptive local training and inference of artificial neural networks. In a paper titled “A Ferroelectric-Memristor Memory for Both Training and Inference” published in Nature Electronics, the team presents a new hybrid memory...

Murata Manufacturing Co., Ltd. is pleased to announce its participation as an exhibitor at CEATEC 2025, located at booth No. 2H325. The event is set to take place from October 14th to October 17th at Makuhari Messe. As IoT technologies continue their rapid evolution and expand across diverse fields, the world is progressing beyond...

Anritsu Corporation will present a live demonstration of a quality evaluation solution for multi-core optical fiber attracting attention as a next-generation optical communications technology at the European Conference on Optical Communication (ECOC 2025; booth C4335), to be held in Copenhagen from September 29 to October 1, 2025. Anritsu's multi-channel OTDR solution for weakly coupled...

TDK Corporation announces its participation at the 2025 Electric & Hybrid Vehicle Technology Expo (EV Tech Expo), showcasing its broad range of electric vehicle and fast-charging innovations on October 7-9, 2025, at Huntington Place in Detroit, Michigan. TDK Corporation of Americas and TDK-Lambda Americas will be located at booth #2204. At booth #2204 at...

Mouser Electronics, Inc., the industry's leading New Product Introduction (NPI) distributor with the widest selection of semiconductors and electronic components, is now stocking the TPS1685 stackable integrated hotswap eFuses from Texas Instruments. The TPS1685 is the industry's first 48V integrated hot-swap eFuse with power-path protection to support the needs of modern data centers, enabling designers to reach power levels beyond...

SmartBear, a leading provider of software quality and visibility solutions, formed a strategic partnership with Adactin, an Australian technology services provider with deep expertise in cloud, AI, and software engineering services. This partnership extends the reach of SmartBear’s software testing solutions to key markets in APAC.  “APAC is a hotbed of innovation with significant investment...

The report shows that generative AI (genAI) adoption in the retail sector has surged to 95%, up from 73% last year. While adoption is up, the use of personal genAI accounts at work in retail has dropped sharply, from around 74% of the workforce using personal genAI accounts at work in January to 36% in June. The use...

DC Motor 31 Click is a compact add-on board designed to drive brushed DC motors providing precise control, torque adjustment, and fault monitoring for a wide range of applications. Produced by MIKROE, the embedded solutions company that dramatically cuts development time by providing innovative hardware and software products based on proven standards, DC Motor 31 Click is a recent...

When you hold your smartphone, drive your car, or even switch on your smart TV, there's an invisible heartbeat inside, semiconductors. These tiny chips power satellites in orbit, fighter jets in the skies, and the AI algorithms reshaping our lives. For years, India has depended on importing these critical components, an Achilles' heel for a country that...

YINCAE, a leader in advanced electronic materials, has introduced Diamond Underfill UF 158D, delivering 8 W/m·K thermal conductivity—a new standard in heat dissipation for advanced semiconductor packaging. Built with nano-engineered diamond particles, UF 158D combines high thermal performance with excellent mechanical reliability, low CTE mismatch, and strong adhesion. It is optimized for flip-chip, 2.5D/3D...