Electronicsmedia

In a new era of computing driven by the convergence of 5G, machine learning and the internet of things (IoT), embedded developers need the richness of Linux-based operating systems. These must meet deterministic system requirements in ever lower power, thermally constrained design environments—all while addressing critical security and reliability requirements. Traditional system-on-chip (SoC) field programmable gate arrays (FPGAs) blending...

Mouser Electronics, Inc., the industry's leading New Product Introduction (NPI) distributor with the widest selection of semiconductors and electronic components, stocks the full line of gallium arsenide (GaN) modules from Texas Instruments (TI). TI’s GaN controllers, regulators, and drivers deliver reduced power with end-to-end power conversion and 5 MHz switching frequencies for high-performance applications such as electric motor design, augmented...

The new STM32ODE Function Pack, the FP-ATR-TOMTOM1 is the first software package for embedded systems to bring multiple TomTom Maps APIs to IoT development platforms, and STMicroelectronics announced that, the X-NUCLEO-GNSS1A1 GNSS/GPS expansion board built around Teseo-LIV3F, and that is at the center of this Function Pack, is now available at online retailers or on ST store for $35. Thanks to a collaboration between ST and TomTom,...

ON Semiconductor has been awarded an IoT Outstanding Technical Innovation Award for its Smart Passive Sensors (SPS). SPS are wireless and battery-free sensors that enable the monitoring of various parameters and, coupled with the company's SPSDEVK1MT-GEVK turnkey solution kit, enable rapid integration into IoT applications. SPSDEVK1MT-GEVK is a predictive maintenance turnkey solution kit that integrates 20 SPS1T001PCB temperature sensors, 20 SPSxT001PET temperature sensors, 20 SPSxT001CER temperature sensors, 20 SPSxM001PET moisture sensors, a 12...

One of the key use cases of 5G is ultra-reliable low-latency communication (URLLC). Important for advanced vehicle-to-X communication use cases, URLLC will enable automated driving in the future. In a joint project between Huawei and Rohde & Schwarz, a precision end-to-end delay measurement system for over-the-air IP transmissions was applied to 5G V2X communication for cooperative driving applications in...

Leti, a research institute at CEA Tech, has reported breakthroughs in six 3D-sequential-integration process steps that previously were considered showstoppers in terms of manufacturability, reliability, performance or cost. CoolCube, CEA-Leti’s 3D monolithic or 3D sequential CMOS technology allows vertically stacking several layers of devices with a unique connecting-via density above tens of million/mm2. This MoreMoore technology decreases dice area by a...

KRYON a leading robotic process automation (RPA) solution provider known for its customer-centric approach and its unique technological innovations, including Kryon Process Discovery – today announced that it has earned Co-Sell Ready status through the Microsoft One Commercial Partner program. Kryon is now among an elite group of global independent software vendors selected by Microsoft for intensive joint sales,...

Lower power consumption and large memory density in low-pin-count packages create a compact efficient platform for smart connected objects Robust new Arm Cortex-M0+ series with simplified power connection, superior EMS protection, and class-leading hardware-based security Enhancements to peripherals, plus support for USB Type-C and Power Delivery By adding the new STM32G0 microcontrollers (MCUs) to the STM32* family, STMicroelectronics (NYSE: STM), a global...

Renesas Electronics introduced the industry’s first USB-C buck-boost battery charger to support both Narrow Voltage Direct Charging (NVDC) and Hybrid Power Buck-Boost (HPBB) charging for notebooks, ultrabooks, tablets, and power banks using the reversible USB Type-C™ connector cable. Through firmware control, the ISL9241 can switch between NVDC and HPBB modes, providing a low-cost and small solution size capable of...

Although most of us have never seen an exoskeleton beyond those in pop culture, they’ve been around for decades. The first examples appeared at the end of the 19th century when a running and jumping apparatus was developed using pneumatics for power. In the 1960s, companies developed wearable “augmentation” devices aimed at military and industrial uses, but these devices...