Electronicsmedia

TTI, Inc., a world-leading specialist distributor of electronic components, is responding to industry trends within the automotive and transportation industries with a portfolio of leading franchises, technologies and products as documented in a new video and EV product guide. There are already over one million electric and hybrid vehicles on Europe’s roads, with EU sales of electric vehicles increasing by...

Moortec Semiconductor Ltd, providers of complete In-Chip PVT Monitoring Subsystems announced today that Esperanto Technologies have selected their complete 7nm Embedded In-Chip Monitoring Subsystem IP for Process, Voltage and Temperature Sensing to optimise performance and increase reliability for their AI Supercomputer-on-a-Chip. Esperanto develops high-performance, energy-efficient computing solutions for Artificial Intelligence (AI) and machine learning (ML) applications based on the open standard...

Digi-Key Electronics, a global electronic components distributor, introduces a new design tool called the DK IoT Studio. The DK IoT Studio is an integrated development environment (IDE) that aims to provide a radically simple way for developers and providers to create IoT solutions.  The DK IoT Studio allows you to go from idea to prototype in minutes without writing...

The new R&S NGE100B power supply series is particularly easy and safe to operate. The robust instruments have galvanically isolated channels and safety binding posts. The color-coding of the channels provides a quick overview. The power supplies are compact, quiet and can optionally be remotely controlled via WLAN, a unique feature for instruments in the under EUR 1000 price...

AAEON, a leading developer of industrial computing solutions, releases the BOXER-6750, a DIN rail-mount-designed box PC with a rich I/O interface. The compact BOXER-6750 measures only 69mm x 183mm x 155mm and is fitted with the Intel Core i3-6100U or, for customers with lower performance demands, the Intel Celeron 3955U. The system also features a DDR4 SODIMM slot for up...

Rohde & Schwarz has demonstrated an innovative test system for conducting radiation measurements on 5G millimeterwave devices in the range from 20 GHz to 87 GHz using a compact antenna test range (CATR). The new solution will offer 5G RF engineers a great advantage, significantly accelerating time-to-market for 5G millimeterwave cellular devices. Compact antenna test ranges (CATR) are the solution...

Mouser Electronics, Inc., the authorized global distributor with the newest semiconductors and electronic components, is now stocking the MAXREFDES101 Health Sensor Platform 2.0 from Maxim Integrated. The MAXREFDES101 incorporates a comprehensive range of Maxim products to provide a rapid prototyping, evaluation, and development platform for medical applications, providing accurate monitoring of body temperature, heart rate, and electrocardiogram (ECG). The Maxim...

Allegro MicroSystems (Hall C5.232) is showcasing a variety of intelligent solutions at Electronica Munich that give automotive and industrial manufacturers a competitive edge – these solutions include a new coreless current sensor IC. This new coreless IC - the ACS37650 - offers substantial space savings by eliminating the need for a concentrator core in high-current sensing applications, such as electric vehicle traction inverters....

New generation of customized microcontrollers on GF's 55nm Low Power Extended (55LPx) automotive-qualified platform, which includes embedded non-volatile memory (SuperFlash®) technology. GLOBALFOUNDRIES and indie Semiconductor today announced the release of a new generation of customized microcontrollers on GF's 55nm Low Power Extended (55LPx) automotive-qualified platform, which includes embedded non-volatile memory (SuperFlash®) technology. indie Semiconductor's new Nigel products are based on ARM Cortex-M4 microcontroller cores, capable...

Infineon Technologies AG acquires Siltectra GmbH, a start-up based in Dresden. The start-up has developed an innovative technology (Cold Split) to process crystal material efficiently and with minimal loss of material. Infineon will use the Cold Split technology to split silicon carbide (SiC) wafers, thus doubling the number of chips out of one wafer. A purchase price of 124...