Electronicsmedia

Synopsys, Inc., announced that Samsung SARC has selected the Synopsys Verification Continuum platform as its primary verification solution for their high-performance, low-power CPU, GPU and system IP designs. Samsung SARC has deployed the Verification Continuum platform for emulation, simulation, verification IP, debug, static verification, formal verification and low-power verification. Synopsys' leadership position in these critical verification technology areas, combined...

Bel Magnetic Solutions, a Bel group company and global leader and manufacturer of MagJack Integrated Connector Modules (ICM) for Networking and Telecommunications applications, introduces an entire suite of low profile, mid-plane mounted, single port ICM’s that can support 10/100 Base-T through 10G Base-T Ethernet applications. With system requirements migrating to smaller and faster speeds, Bel Magnetics MagJack low profile ICM’s...

Stewart Connector, a Bel group company, and world class manufacturer of RJ45 connectors used in Ethernet communications introduces small diameter 28 AWG RJ45 modular plugs for CAT6 and CAT6a applications. Stewart Connector’s new small diameter RJ45 modular plugs support Gigabit Ethernet (1000Base-T) and 10 Gigabit applications and meet the requirements of small diameter patch cables in data center environments. The...

The Japan Marine Recreation Association (JMRA) and Fujitsu Limited, announced the deployment of a cloud-based emergency position reporting system developed by Fujitsu for JMRA's pleasure boat rescue service, the Boat Assistance Network (BAN). The service will be offered beginning in the fall of 2017. When pleasure boats run into mechanical problems or other difficulties, owners can simply access the online emergency...

DENSO Corporation, announced that it will exhibit at the 67th IAA (Internationale Automobil-Ausstellung) Motor Show in Frankfurt, Germany, from September 14-24, 2017. DENSO is committed to developing technologies in three priority fields improving personal mobility: automation, efficiency and connectivity. These technology fields are collectively referred to as the “Core Technologies for Future Mobility.” In a press conference at IAA, DENSO will...

GOEPEL electronic presents SCANFLEX II CUBE, the new generation of modular JTAG/Boundary Scan controllers.  Based on the latest multi-core processors and FPGAs, SCANFLEX II CUBE opens new ways for the Embedded JTAG Solutions. This test and validation method uses embedded instruments to test and program complex boards. This results in a high test depth with less use of external...

Highlights: New retanning agents with optimized molecular weight distribution Innovative concept for recycling leather by-products New water based dyes for finishing High performance products for effective waste water treatment Trade show participation in Shanghai, August 30 through September 1, 2017, Hall 2, Stand E03 “We are committed to sustainability in terms of more efficient production, by-product material recycling and reduced...

As some of you would know, Nefarious bots including those that exploit Internet of Things (IoT) devices as weapons of attack are one of the fastest-growing and changing threats in the security landscape. The Mirai attacks in 2016 demonstrated what can happen when hackers deploy a bot army to take control of insecure IoT devices. Yet, those kinds of attacks...

What was once only seen in movies is now reality – and it’s gaining acceptance across many industries and audiences. More and more companies are adopting the machine learning technology for use in their products and services, understanding the significant value it adds in working with an audience that expects personalisation. There are some standout companies that are now making significant strides...

SWINDON Silicon Systems, a Sensata Technologies company, is to exhibit at the forthcoming Engineering Design Show (October 18-19, Ricoh Arena, Coventry – Stand H2) and will demonstrate the advantages of Application Specific Integrated Circuits (ASIC), System on Chip (SoC) and System in Package (SiP) solutions that are designed to be at the heart of intelligent sensing solutions. An increasing number...