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Indium Corporation Expert to Present on Advancing Thermal Performance at TestConX China

Foo Siang Hooi, IndiumCorp
Indium Corporation Assistant Product Manager Foo Siang Hooi will deliver a technical presentation at TestConX China, to be held November 13 in Shanghai. He will focus on advancing thermal performance in high-performance computing, automotive electronics, and power semiconductor applications with an innovative thermal interface material (TIM). The presentation, Advancing Thermal Performance: Next-Generation Pattern X–Compressible Metal TIM for Warped and Non-Planar Surfaces, will focus on...

Singapore’s largest industrial district cooling system begins operations to support STMicroelectronics’ decarbonization strategy

district cooling system
Highlights: Designed, built, owned, and operated by a joint venture between SP Group and Daikin Airconditioning (Singapore), the innovative district cooling system will significantly improve the environmental performance of ST's high-volume semiconductor manufacturing site in Singapore New system expected to reduce carbon emissions by 120,000 tonnes per year, cooling-related...

Embedded in-system programming on two channels simultaneously with integrated power supply

FlashFOX
Microcontrollers, flash devices, and PLD/FPGA need to be programmed quickly and flexibly. To meet the most diverse requirements, GÖPEL electronic now offers its Universal Programmer FlashFOX in a new version with two asynchronous parallel channels and four independently integrated power supplies for the targets to be programmed. The new model complements the existing 4- and 8-channel versions,...

Panasonic Industry Europe Confirms Conformity of Wireless Modules with new Radio Equipment Directive EN 18031-1:2024

Panasonic Industry Europe
Panasonic Industry Europe is pleased to confirm alignment of its wireless modules with the newly adopted European Radio Equipment Directive (RED) EN 18031-1:2024. From 1 August 2025, all wireless devices placed on the EU market must comply with all RED cybersecurity requirements. This is a binding precursor to the Cyber Resilience Act (CRA) which aims to secure digital...

The Global Edge AI Chip Market: Bringing Intelligence to Where the Data Lives

Edge AI Chip Market
Edge AI Chip Market: In the relentless pursuit of smarter and more responsive technology, the focus has traditionally been on raw computational power in massive cloud data centers. However, a pivotal shift is underway, moving intelligence from the core to the periphery: the world of Edge AI. At the heart of this revolution is the Edge AI...

Fujitsu and Kawasaki Frontale sign global Sports for Nature Framework in Japan first

Fujitsu
Fujitsu Limited and professional football club Kawasaki Frontale Co., Ltd. announced that American football team Fujitsu Frontiers, women’s basketball team Fujitsu Red Wave, in addition to the football team itself have become the first sports teams in Japan to join the "Sports for Nature" Framework. Sports for Nature is a joint initiative of the International...

New MEMS-based MultiGBASE-T1 FIUs from Pickering ramp up test system bandwidth, throughput & operational life

MultiGBASE‑T1
Pickering Interfaces the leading supplier of modular signal switching and simulation solutions for use in electronic test and verification, has announced a major new addition to its extensive range of PXI FIU (fault insertion unit) switch modules: available in a compact single-slot form factor, models40-205 (PXI) and 42-205 (PXIe) are part of the company’s two-wire serial interface fault insertion switching family. Based on MEMS (micro-electro-mechanical systems) switches,...

Semiconductor Packaging: The Unsung Hero Powering Tomorrow’s Electronics

Semiconductor Packaging
In the race to make electronics smaller, faster, and more powerful, the spotlight often falls on transistor density and chip architecture. However, a critical revolution is happening just one step away: in the world of semiconductor packaging. This is no longer just a protective shell; it has become a pivotal enabler of performance, directly impacting everything from the...

Rohde & Schwarz transfers Pixel Power to Imagine Communications

Rohde & Schwarz
Rohde & Schwarz and Imagine Communications announced a definitive agreement under which Imagine will acquire Pixel Power Limited, a wholly owned subsidiary of Rohde & Schwarz. The transaction represents a strategic alignment for both companies, enabling Imagine to offer broadcast customers the most extensive portfolio of live production and playout solutions on the market while allowing Rohde...

Indium Corporation Introduces 2026 DIY Internship Program to Empower the Next Generation of Industry Leaders

DIY Internship 2026
Indium Corporation is proud to announce its 2026 Internship Program, introducing a do-it-yourself (DIY) format that allows students to shape a personalized professional experience based on their individual career goals and interests. This flexible approach ensures that each intern can focus on projects and skill development that matter most to them while gaining hands-on experience in a...

Interview