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Junkosha Launches Next-Gen 0.5 mm Connector Cable “MWX0A5” for Ultra-High Frequency Testing at EuMW 2025

MWX0A5
Global interconnect pioneers, Junkosha, have unveiled their latest Microwave/mmWave Coaxial Cable Assembly solution at this year's European Microwave Week (EuMW 2025) capable of transmitting from DC to 250 GHz.  As the first solution of its kind, the new 0.5 mm connector cable "MWX0A5" represents a unique capability in the marketplace, placing Junkosha at the forefront of high-frequency cable innovation for the demands of probe...

Qualcomm and Google Cloud Deepen Collaboration to Bring Agentic AI Experiences to the Auto Industry

Agentic AI for Automotive
Highlights: Landmark technical collaboration brings together the strengths of two industry leaders with Google Gemini models and Qualcomm Snapdragon Digital Chassis solutions to help automakers create deeply personalized and advanced AI agents that will redefine customers’ experiences at every point in their journeys. Combines the best of both worlds...

Qualcomm and HARMAN Collaborate to Advance Generative AI in Automotive

Qualcomm
Highlights: Integration of Qualcomm’s Snapdragon Cockpit Elite platforms into HARMAN’s Ready product portfolio for intelligent in-cabin experiences. Collaboration on AI enabled cockpit and ADAS solutions. Coordinated go-to-market strategy targeting global OEMs in Europe and China. Today’s drivers expect vehicles to update, adapt...

Mouser Electronics and Arduino Present Webinar on Accelerating Intelligent Industrial Automation Deployment with Arduino Pro

Industrial Automation
Mouser Electronics, Inc., the authorised global distributor with the newest semiconductors and electronic components, has teamed up with Arduino to provide the engineering community with a new webinar titled "How to Use Arduino to Go Beyond Prototyping in Industrial Automation". This free-to-attend webinar will take place on 30 September 2025 at 17:00 CET. As industrial environments...

Anritsu Enhances PCI Express 6.0 Test Efficiency

PCIe 6.0
Anritsu Corporation announces the release of an enhanced Sequence Editor feature for its high-performance Bit Error Rate Tester (BERT), the Signal Quality Analyzer-R MP1900A. This enhancement supports intuitive GUI-based creation of test sequences for abnormal and stress conditions, facilitating efficient evaluation of PCI Express 6.0 (PCIe 6.0) devices. It allows engineers to isolate physical and logical-layer errors in...

Samtec Inks Second-Source License Agreement with Molex to Expand Reach of Si-Fly HD High-Speed Interconnects for Data Center and AI Applications 

License Agreement
Samtec, Inc., the service leader in the connector industry and a premier provider of high-speed connectivity solutions, and Molex, a global electronics leader and connectivity innovator, announced a license agreement naming Molex as a second source for the Samtec Si-Fly® HD product family.  This collaboration provides customers with extended product availability and supply flexibility to a portfolio of...

TDK presents ultra-small PFC capacitors for space-constrained consumer applications

PFC Capacitors
TDK Corporation introduces the B3270xP, a series of ultra-small, metallized polypropylene (MKP) film capacitors tailored for power factor correction (PFC) stages in power supplies for consumer electronics. With their compact design and self-healing properties, these components are engineered for use in adapters and power supplies for devices such as laptops and gaming consoles. Their minimized footprint addresses...

TDK announces that Tronics enters the machine and asset health monitoring market with vibration sensor solutions

Tronics Microsystems
Highlights: TDK’s subsidiary, Tronics Microsystems, expands into vibration sensor solutions, targeting process and asset monitoring to support predictive maintenance and industrial IoT applications  Building on two decades of MEMS expertise, the company leverages its legacy in inertial sensors to engineer high-precision vibration sensor solutions  Strategic evolution...

MVG and Anritsu Partner to Advance NTN OTA Testing for 3GPP Mobile and IoT Devices

NTN OTA Testing
Microwave Vision Group (MVG) and Anritsu announce the availability of a joint testing solution supporting Over-The-Air (OTA) validation of Non-Terrestrial Network (NTN) communications for Mobile and IoT devices. MVG has adapted its multi-probe OTA systems to integrate the capabilities of Anritsu’s Radio Communication Analyzer MT8821C, delivering a lab-based environment for realistic satellite link emulation in compliance with 3GPP...

Cetec ERP Expands into Europe with New Strategic Partner

Cetec ERP
Cetec ERP is proud to announce a new partnership with Arkadiusz Rataj, a seasoned consultant and expert in the electronics industry, as part of its strategic expansion into the European market. With over 20 years of leadership in the electronic components sector, Arkadiusz brings a proven track record of driving sales growth, building data-driven...

Interview