Electronicsmedia

Smith, a leading global distributor of electronic components and semiconductors, announces its upcoming exhibition at electronica India from Wednesday, September 17, to Friday, September 19. The event will take place from 9:00 to 18:00 each day at the Bangalore International Exhibition Centre (BIEC) in Bangalore, India. This is the third time Smith has exhibited at electronica India.

As AI, HPC, and 5G drive semiconductor innovation, advanced packaging has become the next strategic focus. Yole Group projects the market to exceed USD 50 billion by 2025, with fan-out panel-level packaging (FOPLP) growing more than 15% annually. E&R Engineering (TPE: 8027) will present its latest laser and plasma solutions at SEMICON Taiwan 2025, covering FOPLP, Through-Silicon...

HighTec EDV-Systeme, Elektrobit and Infineon are partnering to accelerate software innovation in the automotive industry by enabling the integration of Rust applications with AUTOSAR Classic basic software.  As ecosystem partners to Infineon Technologies’ Drive Core for AURIX microcontrollers, HighTec and Elektrobit are delivering a comprehensive development bundle. This joint offering includes Elektrobit’s EB tresos...

Rohde & Schwarz will showcase its solutions and capabilities supporting multi-domain operations by ensuring true spectrum dominance in all domains and along the complete signal chain at MSPO 2025. Rohde & Schwarz, a leading provider of cutting-edge communications and security solutions, is proud to announce its participation at the 33rd International Defence Industry Exhibition MSPO, September 2 to...

At The Things Conference 2025 in Amsterdam, The Netherlands from 23rd to 24th September 2025, Thomas Steen Halkier, CEO of NeoCortec, will be giving a keynote speech on Tuesday 23rd September at 15.55h at the Things Forum One. Halkier will be talking about “NeoMesh on LoRa: Bringing True Mesh Networking to the LoRa PHY”. The keynote explores how NeoMesh on LoRa...

The future of connectivity is often thought of as a terrestrial pursuit, but it's increasingly taking shape in orbit. As India prepares for a new wave of digital transformation, satellite-powered broadband is stepping out from the shadows of speculation and into the light of operational reality. In one of its biggest connectivity milestones to date, DE-CIX India...

Aerospace and defense applications rely on Position, Navigation and Timing (PNT) technology for mission-critical accuracy and reliability. However, integrating PNT into a design requires extensive domain knowledge in this area. To fast track the development process, Microchip Technology announces its portfolio of GNSS Disciplined Oscillator (GNSSDO) Modules that integrate the company's renowned embedded atomic clock and oscillator technologies, including the...

Amphenol Industrial Operations has expanded its rugged Tru-Loc connector series with new 4-way plug and receptacle options, strengthening the portfolio of high-performance interconnects for automotive, heavy equipment, and oil-cooled motor applications. Built for Harsh Environments The Tru-Loc series is engineered for reliability under vibration, temperature extremes, and continuous oil exposure. Leveraging Amphenol’s proprietary...

2025: The year of explosion for AI smart factories and robot automation In recent years, the integration of artificial intelligence (AI) and industrial automation has been rapidly driving innovation in the manufacturing industry, especially as smart factory development reaches a critical juncture. According to market research predictions, 2025 will be a year of explosive...

Carling Technologies, a Littelfuse, Inc. brand, announced the addition of a window lift switch option to the popular L-Series sealed, snap-in switch lineup. Available for 12 VDC and 24 VDC systems with current ratings from 0.4 to 20 A, the new window lift switch features above-panel components that are sealed to an IP67 rating for protection against dust, debris,...