Gateworks joins forces with NXP to unveil new USA-made M.2 AI acceleration card, featuring decoupled AI architecture.
At Embedded World, Gateworks and NXP are announcing The GW16168 AI acceleration card.
Using and deploying your own AI is a costly process, whether you are talking about time, manpower or even financial costs. Incorporating newer AI acceleration hardware often entails re-thinking your entire hardware stack, from Single Board Computers (SBCs) to custom cooling...
VIAVI Launches True-Phase DAS Fiber Sensing Interrogator with AI/ML at the Edge
True-Phase DAS Fiber Sensing Interrogator:
VIAVI Solutions has announced the launch of next-generation fiber test head for distributed acoustic sensing (FTH-DAS) to enhance their NITRO Fiber Sensing solution. The FTH-DAS is a true-phase DAS interrogator with embedded AI and machine learning (ML) engine. Designed for the network edge, the FTH-DAS interrogator enables multi-event...
Everspin Launches New Generation of Unified Memory for Embedded Systems
Everspin Technologies, Inc., the world's leading developer and manufacturer of magnetoresistive random access memory (MRAM) persistent memory solutions, announced the UNISYST MRAM family, a new generation of unified memory designed to fundamentally change how embedded systems store and access code and data.
"System designers are running into the physical and performance limits of NOR flash, especially...
Grinn Partners with Synaptics, Google Research, and RS to Bring Synaptics Coral Dev Board to Market
Grinn, a leading specialist in embedded systems and IoT design, is proud to announce its role in the hardware design and development of the new, limited-edition Synaptics Coral Dev Board, architected to bring AI-accelerated, multimodal applications to life.
The Synaptics Coral Dev Board is purpose-built to run advanced Edge AI applications across wearables, hearables,...
Forlinx Debuts a Multimodal Demo Based on NXP’s i.MX 95 SoC and Ara240 Computing Card at the Embedded World 2026
Forlinx Multimodal Demo Based on NXP's i.MX 95 SoC and Ara240 Computing Card at the Embedded World 2026
The global premier event for embedded systems — Embedded World 2026 — will take place in Nuremberg, Germany, from March 10 to 12. As a Gold Partner of NXP Semiconductors, Forlinx will be present at Booth H3-561 to showcase breakthroughs and...
Farnell and Same Sky Enter into Distribution Agreement
Farnell-Same Sky Distribution Agreement:
Same Sky announced it has signed a global distribution agreement with Farnell, one of the world's premier distributors of electronic components. As a part of the agreement, Farnell will distribute and market Same Sky's extensive product portfolio, including audio, interconnect, thermal management, and more. In addition to product support through the...
Ambient Scientific powers new ‘MAI’ women’s safety wearable, enabling always-on AI and two-week battery life.
On International Women's Day and at Embedded World, Ambient Scientific has announced its partnership with Dimension NXG to power 'MAI', a pioneering new AI wearable for women's health and safety. Utilising Ambient Scientific's low-power GPX-10 processor, the device boasts up to two-weeks of battery life.
MAI is a women-first health companion with a built-in...
Agricultural Biosecurity Industry Set to Grow 2X by 2032: Market Trends & Data Insights
The global Agricultural Biosecurity sector has become a critical pillar of food safety, livestock protection, and global trade security. According to research insights published by Marketintelo, the Agricultural Biosecurity Market was valued at approximately USD 9.6 billion in 2023, rising from USD 8.9 billion in 2022, reflecting a 7.8% year-over-year growth rate. The market is forecast to...
VJ Electronix Introduces Summit LT150 Rework System for Large, High-Density Assemblies
Summit LT150 Rework System:
VJ Electronix, Inc., the leader in rework technologies and global provider of advanced X-ray inspection and component counting systems, announced the launch of the Summit LT150, a new addition to its Summit rework platform designed to handle the growing size and complexity of modern electronics assemblies.
FAMES Announces 2026 Open-Access Call for Chip Industry Stakeholders
FAMES 2026 Open-Access Call:
The FAMES Pilot Line launched its second Open-Access Call for European semiconductor stakeholders to join the groundbreaking EU initiative focused on new chip architectures to boost European tech sovereignty. An online launch event was held this afternoon to provide researchers, academia, and industry teams with a detailed overview of the technologies currently available and the...
















