Electronicsmedia

Indium Corporation, a leading materials provider for the electronics assembly market, will feature its high-reliability solder solutions at APEX EXPO 2026, March 17-19, in Anaheim, California. Indium Corporation's showcased products include: Durafuse LT is an award-winning solder paste alloy system with versatile characteristics that provide energy savings and high reliability...

A U.S.-based electric vehicle charging station manufacturer cut its development timeline by approximately 50% after adopting a System on Module (SoM)-based platform from Variscite, a leading global SoM designer, developer and manufacturer. The result illustrates how Variscite's SoM solutions - combining pin compatibility, information security ISO 27001 certification, extended longevity guarantees, and extensive customizability - are helping...

Real-Time Sensing in Cars: Ask someone to draw a car and the shape will probably be quite similar: a windscreen, four wheels, and doors.  While the external appearance of a car may remain largely unchanged, internal technologies have evolved significantly, transforming the characteristics and capabilities of modern vehicles. Where we once spoke about horsepower, speed, and fuel consumption, today we are more...

AAEON's UP brand has announced the release of the Intelli TWL01 Edge, an Industrial Multimedia PC with dual 4K displays, multiple mounting options, and a range of Intel Core Processor N-series CPUs (formerly Twin Lake). Built to provide a cost-effective platform for multimedia solution building, the Intelli TWL01 Edge hosts two HDMI 2.0b ports...

VIAVI Solutions will showcase advanced technologies for the validation of next generation AI fabrics at scale at Optical Fiber Communication (OFC) 2026 from March 17-19 at the Los Angeles Convention Center. The evolution of AI, security and high-speed photonics have converged to force a change in validation and optimization strategies. Today, the industry requires...

Bringing a high-performance AI product to market usually takes years of grueling hardware development. Today, Grinn is working together with Renesas to change that narrative. Grinn announced a collaboration centered on the launch of the Grinn ReneSOM-V2H, a production-ready System-on-Module (SOM) that allows engineers to move directly from concept to application. Grinn significantly lowers...

A breakthrough in advanced packaging materials has arrived with the introduction of TM230D, an innovative 3-in-1 sintering material designed to simplify processing while delivering exceptional thermal & reliability performance for next-generation power electronics & high-performance semiconductor applications. TM230D features thermal conductivity up to 110 W/m·K, enabling efficient heat dissipation critical for modern high-power devices....

DENSO CORPORATION announces that its Carbon Footprint (CFP) calculation application has received the "Application Certification" under the certification program operated by the Automotive and Battery Traceability Center Association, Inc. (hereinafter "ABtC"). In recent years, against the backdrop of the depletion of natural resources and the environmental impact caused by waste, there has been a...

During MWC Barcelona 2026, Huawei released 115 industrial intelligence showcases, together with its customers, during Industrial Digital and Intelligent Transformation Summit 2026. The summit, titled Advancing Industrial All Intelligence, was held by Huawei to explore new practices in industrial intelligence with its customers, partners, and peers. In addition, Huawei also announced the launch of upgrades to its...

GaN Semiconductor Devices Market: The global Gallium Nitride Semiconductor Devices Market is entering a decisive growth phase, driven by technological innovation, expanding applications in high-performance electronics, and widespread industry adoption. The latest market research indicates that gallium nitride (GaN) semiconductor devices are rapidly transforming the landscape of power electronics, RF communications, and high-efficiency systems — positioning...