Electronicsmedia

PCIM Asia Shenzhen Conference 2026: The PCIM Asia Shenzhen Conference 2026 serves as a key gathering for researchers and engineers from across the global power electronics community. The 2026 conference will focus on the growing domain of power electronics applications in artificial intelligence (AI) and data centres, with these topics becoming increasingly important...

In 2025, the global demand for radiation-hardened electronic components is accelerating due to expanding space missions, defense modernization, nuclear energy upgrades, and high-reliability industrial systems. According to recent industry analysis from Dataintelo, the radiation-hardened electronic components market is currently valued at approximately $2 billion in 2025, with projections indicating growth to $3.5–3.8 billion by 2032, reflecting a...

oToBrite, a provider of Vision AI solutions for unmanned vehicles, off-highway machines, and robotics, announced two plug-and-play GMSL2 camera enablement kits for NVIDIA Jetson Orin Nano and NVIDIA Jetson AGX Orin developer kits. Each kit combines a rugged oToBrite GMSL2 camera adapter built around an ADI/MAXIM MAX96724 deserializer with the corresponding NVIDIA Jetson developer kit in its original packaging, plus a setup microSD card or pre-packaged BSP (board...

In a joint 6G AI proof-of-concept demonstration, the CMX500 one-box tester from Rohde & Schwarz shows significant downlink throughput gain in an AI-based wireless transmission compared to conventional non-AI technology. Additionally, the demonstration illustrates how this translates to an enhanced video streaming user experience. This collaboration validates the feasibility of multi-vendor AI interoperability for future 6G standardization

BMP585 Pressure Sensor: Bosch Sensortec's high-performance BMP585 pressure sensor is validated for use with Qualcomm Technologies' new Snapdragon Wear Elite Platform. The sensor delivers precise altitude data for enhanced fitness tracking (elevation), improved E911 emergency location (z-axis), and smarter user context awareness. Bosch Sensortec's comprehensive...

VLMRGB1500… RGB LED: Vishay Intertechnology, Inc. introduced a new tricolor LED that provides luminous intensity to 252 mcd at 5 mA for RGB displays and backlighting. Featuring common anode and separate cathode connections for the red, true green, and blue LED chips inside its compact 1.0 mm by 1.0 mm by 0.65 mm...

28nm RH850/U2C Automotive MCU: Latest RH850 family addition building on 4 billion+ units shipped since 2013 Rich connectivity and advanced security for next‑gen E/E architectures Supports latest automotive standards with easy ECU migration and upgrades Lower active and standby power, reducing ECU power demand Renesas Electronics...

Precise timing has always been a foundational aspect of electronics and system design. What’s changed is when engineers address it. Timing is no longer an afterthought—selected late in the design cycle, after core decisions are made. While engineers may not focus on their specific timing components early in the design cycle, timing itself shapes system architecture from...

Amphenol RF is pleased to introduce a new rear-mount bulkhead SMA jack into our SMA connector portfolio, designed to enable secure panel mounting. This connector offers low VSWR performance which ensures reliable impedance matching and signal integrity. The end-launch PCB interface has a 10 millimeter center pin which supports controlled impedance transitions at the board edge. This...

Indium Corporation, a leading materials provider for the electronics assembly market, will feature its high-reliability solder solutions at APEX EXPO 2026, March 17-19, in Anaheim, California. Indium Corporation's showcased products include: Durafuse LT is an award-winning solder paste alloy system with versatile characteristics that provide energy savings and high reliability...