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STMicroelectronics completes GSMA certification for ST4SIM-300 eSIM for IoT

ST4SIM-300 eSIM
GSMA certification for ST4SIM-300 eSIM for IoT STMicroelectronics has completed certification of its ST4SIM-300 embedded SIM (eSIM) to GSMA SGP.32 eSIM IoT specification. Certification assures interoperability with cellular networks and IoT service platforms worldwide, with remote provisioning and easy switching between network providers. The ST4SIM-300 is among the first certified eSIMs to support SGP.32, the...

Infineon gains approval of Science Based Targets initiative for ambitious CO2 emission reduction targets

Elke Reichart
Scope 1 and 2 targets meet highest SBTi standard for near-term reduction goals Infineon sets ambitious scope 3 target to further reduce emissions along the supply chain Active work with over one hundred suppliers to further reduce emissions Infineon Technologies AG has reached another...

STMicroelectronics to showcase Edge AI and automation solutions at SEMICON Southeast Asia 2025

SEMICON Southeast Asia 2025
SEMICON Southeast Asia 2025 More than 10 exciting demos addressing Edge AI and sensors, wireless connectivity, automotive, and factory-automation solutions ST will be speaking on Advanced Packaging, Sustainability, MEMS for Medical Applications, and Talent Acquisition STMicroelectronics (NYSE: STM), a global semiconductor leader serving...

Introducing Diotec’s New DIF065SIC020: High-Efficiency 650V SiC MOSFET in TO-247-4L Package

DIF065SIC020 SiC MOSFET
DIF065SIC020 650V SiC MOSFET Diotec Semiconductor introduces its latest Silicon Carbide MOSFET DIF065SIC020, which features an exceptionally low RDS(on) values of 20mΩ. It is encapsulated in the new TO-247-4L, consisting a fourth lead, also known as Kelvin Source. It enables faster switching speeds, lower power losses and higher reliability. This makes the ideally suited...

Cassava Technologies and Sand Technologies partner to boost Artificial Intelligence (AI) capabilities and accessibility for African enterprises

Cassava Technologies
Cassava Technologies, a global technology leader of African heritage, is pleased to announce that it has signed a Memorandum of Understanding (MoU) with Sand Technologies, a leading global enterprise AI solutions company and a key player in Africa's emerging artificial intelligence (AI) ecosystem. The strategic partnership, announced at the Global AI Summit on Africa in Kigali, Rwanda,...

Siemens and TURN2X join forces to scale up green energy production

MoU TURN2X
Highlights: Siemens to become preferred supplier and technology partner for TURN2X’s production of renewable natural gas Agreement includes broad scope from the Siemens Xcelerator portfolio Partnership directly contributes to expanding the availability of green energy alternatives The technology company Siemens...

CEA-Leti Reports Co-Integration of GaN MicroLED and Organic Photodetectors for Multifunctional Display Applications

GaN MicroLED
Targeting next-generation of display technology, CEA-Leti presented its heterogeneous co-integration of GaN microLED technology and organic photodetectors (OPDs), a major step toward multifunctional displays that combine both display and sensing capabilities. The results were presented in a paper at the Display Week conference titled “Co-Integration of Organic Photodetector with MicroLED Dedicated to Multifunctional Display Application.”

Novotech Leverages an Intelligent “Cloud, Network & Security” Solution to Propel Global Drug R&D

China Entercom
CITIC Telecom International CPC Limited (“CITIC Telecom CPC”), a wholly-owned subsidiary of CITIC Telecom International Holdings Limited (SEHK: 1883) is pleased to announce that its subsidiary, China Enterprise ICT Solutions Limited (“China Entercom”), leveraging its extensive global network resources and intelligent “Cloud, Network & Security” integrated solution, is assisting Novotech in enhancing its digital innovation capabilities. Through...

New at Mouser: BeagleBoard CC33 2.4GHz Wi-Fi 6 Bluetooth LE Wireless Modules

CC33 wireless modules
Mouser Electronics, Inc., the authorized global distributor with the newest electronic components and industrial automation products, is now shipping the CC33 wireless modules from BeagleBoard. The BM3301 modules are high-performance 2.4GHz Wi-Fi 6 and Bluetooth Low Energy 5.4 combo wireless modules for industrial IoT, automotive, smart home, consumer electronics, healthcare, and embedded systems applications.

Building the Future: AIF and Ericsson Lead a Scalable, Inclusive Model for Digital Learning Across Government Schools in Uttar Pradesh

AIF and Ericsson Partnership for STEM education
The American India Foundation Trust (AIF), in partnership with Ericsson, has successfully concluded the first phase of a transformative digital education project that has redefined the future of STEM learning for over 12,500 students across 50 government schools in Uttar Pradesh. At a time when access to quality STEM education remains deeply unequal, especially for girls and...

Interview