STMicroelectronics to showcase its latest innovations in Automotive, Industrial, and Enabling Technologies at electronica China 2025
STMicroelectronics, a global semiconductor leader serving customers across the spectrum of electronics applications, will exhibit at electronica China 2025(Booth N5.601)on April 15-17. Under the theme of “Our technology starts with You”, ST will exhibit a wide array of innovative solutions across the end markets of Automotive and Industrial, based on its state-of-the-art Enabling Technologies. In total, over 50 interactive demos and...
Fujitsu’s Japanese language enhanced LLM Takane offering now available on Nutanix Enterprise AI solution
Fujitsu Limited and Nutanix, a leader in hybrid multicloud computing announced the validation of Fujitsu's Takane, a largescale language model (LLM) with world-class Japanese language capabilities designed for enterprise utilization on the Nutanix Enterprise AI (NAI) solution - which supports the deployment of a wide range of generative AI models on-premises and in public clouds, and the hybrid...
Indium Corporation to Feature Materials Solutions Powering Sustainability at PCIM Europe
PCIM Europe 2025
As one of the leading materials providers in the electronics assembly and solder industries, Indium Corporation is proud to feature its lineup of high-reliability products at PCIM Europe, taking place May 6-8, in Nuremberg, Germany.
Indium Corporation specializes in power device packaging, offering a portfolio of advanced material solutions encompassing the entire...
SiC Schottky Diodes from Diodes Incorporated Deliver Industry-Leading FOM and System Efficiency
SiC Schottky Diodes from Diodes Incorporated
Diodes Incorporated (Diodes) announces the expansion of its silicon carbide (SiC) product portfolio with a series of five high-performance, low figure-of-merit (FOM) 650V SiC Schottky diodes. Rated at 4A, 6A, 8A, 10A, and 12A, the DSCxxA065LP series is housed in the ultra-thermally efficient T-DFN8080-4 package and is designed for high-efficiency...
NOVOSENSE Introduces Highly Integrated SoC for Automotive Lighting Systems
NOVOSENSE Microelectronics, a semiconductor company specializing in high-performance analog and mixed-signal chips, has announced the launch of the NSUC1500-Q1, a highly integrated System-on-Chip (SoC) designed to meet the demands of modern automotive ambient lighting systems.
The NSUC1500-Q1 can be combined with the high-precision NSLxxxxx series of linear LED drivers optimized for conventional taillights, through-type dynamic...
TDK introduces the first embedded gate driver powering efficiency in EV thermal systems
Designed for LIN controlled automotive blowers, pumps, and fans in thermal systems
Also powers smart BLDC actuators in seats, doors, lift-gates and charge-doors
Fully supports Field Oriented Control (FOC) algorithms for low noise and high efficiency
TDK Corporation extends the power capability of its...
Multilayer Ceramic Capacitors: TDK offers MLCCs with the industry’s highest capacitance at 100V for automotive applications in 3225 case size
Highlights:
New 100 V product for automotive applications with 10 μF capacitance in 3225 case size (achieving large capacitance)
Contributing to the reduction of component count and the miniaturization of sets
Qualified based on AEC-Q200
TDK Corporation has expanded its CGA...
Industry-first 20kV stand-off relay sets new standard for high voltage switching
20kV Stand-Off Reed Relay
Pickering Electronics, a global leader in high-performance reed relays, has introduced a new 20kV addition to its long-established high voltage Series 63 range. This latest addition sets a new industry standard by offering 20kV stand-off across the switch contacts – a first-of-its-kind capability that no other relay manufacturer currently offers. The new...
GigaDevice’s GD5F1GM9 Series High-Speed QSPI NAND Flash Sets New Benchmark with Breakthrough Read Speeds for Accelerated Application Startup
QSPI NAND Flash
GigaDevice, a leading semiconductor company specializing in Flash Memory, 32-bit Microcontrollers (MCUs), Sensors, Analog products and solutions, announces the launch of its GD5F1GM9 high-speed QSPI NAND Flash, which features breakthrough read speeds and innovative Bad Block Management (BBM) functionality.
The GD5F1GM9 series combines the high-speed read performance of NOR Flash with...
MIKROE Launches 1800th Click board: Stephano-I Click delivers WiFi and Bluetooth LE connectivity for reliable IoT connectivity
Stephano-I Click from MIKROE
The embedded solutions company that dramatically cuts development time by providing innovative hardware and software products based on proven standards, is a compact add-on board designed to add WiFi and Bluetooth LE connectivity to any embedded application. A new member of MIKROE’s 1800-strong mikroBUS -enabled Click board family, this board features the Stephano-I (2617011025000) radio module from Würth Elektronik.

















