Electronicsmedia

AI-Edge Fanless Panel PCs: NEXCOM reveals new fanless panel PCs at EW 2026 targeting industrial automation, smart manufacturing and control applications The APPC C21-01 series features FHD Multiple-Purpose Panel PCs with Intel Core Ultra5 125U, available in 15.6-inch and 21.5 inch models NEXCOM also showcases...

The global Embedded Component PCB market is shifting from incremental innovation to structural transformation. According to insights published by Marketintelo, the industry generated USD 3.2 billion in revenue in 2023, climbed to USD 3.5 billion in 2024, and is projected to reach USD 6.1 billion by 2031, expanding at a 9.2% CAGR (2024–2031). Unlike...

As the global security environment becomes increasingly shaped by contested electromagnetic spectrum operations, defense and security organizations face growing challenges from non-cooperative UAVs, complex RF environments, and sophisticated signal manipulation. At Enforce Tac 2026, Aaronia AG demonstrated how its AARTOS DDS platform addresses these evolving threats through a fully integrated approach to detection, analysis, and electronic warfare.

e-con Systems, a global provider of OEM and ODM vision solutions, will showcase its latest AI-driven imaging innovations at NVIDIA GTC 2026 (March 16–19, San Jose, USA) and Embedded World 2026 (March 10–12, Nuremberg, Germany). Visit us at our Booth #3119 (NVIDIA GTC) and Hall 2, QUAD GmbH’sBooth #2-111 (Embedded World) to see live...

NEC Corporation has expanded the capabilities of its User Plane Function (UPF) for telecom operators by adding support for second-generation AWS Outposts racks, further strengthening its multi deployment model. With this enhancement, NEC’s UPF can now operate consistently across on-premises environments, the cloud, edge locations, and AWS Outposts racks installed within operators’ network sites. This enables flexible deployment...

As devices demand faster access to data—driven by the need for richer user experiences, low latency and increasingly sophisticated edge AI workloads—flash storage needs to keep up. Representing a major step forward in delivering faster data access and improved performance, MIPI M-PHY and MIPI UniPro were recently updated to pave the way for the forthcoming JEDEC Universal Flash Storage (UFS)...

single-crimp N-Type connectors: Amphenol RF is pleased to announce single-crimp N-Type connectors as part of our growing interconnect portfolio. These connectors offer the ability to attach the connectors to cable with only one crimp of the ferrule, eliminating the need to crimp the contact separately. These connectors are IP67-rated when mated and feature a hex nut built into the body for easy mating. Single-crimp N-Type...

As a leading provider of advanced materials solutions for power device packaging, Indium Corporation will feature its lineup of high-reliability products at CIPS – International Conference on Integrated Power Electronics Systems, March 10-12, in Dresden, Germany. Company products to be highlighted include the following: Durafuse HT is an innovative high-temperature lead-free paste...

Variscite's New SMARC SoMs at Embedded World 2026: Variscite, a leading global System on Module (SoM) designer, developer and manufacturer, will demonstrate a new family of SoMs conforming to the Smart Mobility Architecture (SMARC) interface standard at Embedded World 2026, held March 10-12 in Nuremberg, Germany. The demonstrations will include the first public showing...

STMicroelectronics (NYSE: STM), a global semiconductor leader serving customers across the spectrum of electronics applications, published its Annual Report on Form 20-F for the year ended December 31, 2025 and filed it with the United States Securities and Exchange Commission (SEC). The Company’s Form 20-F based on U.S. GAAP and complete audited financial statements is available at www.st.com and...