NEC Implements AI Code Review Service “Metabob,” Reducing Technical Verification Time by Up to 66%
NEC Corporation announced the operation of "Metabob," an AI-powered code review service for software development. The service is provided by Metabob, Inc., a Santa Clara-based AI startup established through NEC X, Inc.'s new business creation initiatives.
Metabob is an important advancement for the development of AI agents, software programs that use AI to autonomously achieve...
Rohde & Schwarz and LITEON demonstrate high‑throughput 5G femtocell testing with the PVT360A
Rohde & Schwarz and LITEON collaborate to showcase a production-optimized test setup for high-throughput multi-device testing at MWC Barcelona 2026. The demonstration will feature the high-performance PVT360A vector performance tester from Rohde & Schwarz characterizing in parallel four new LITEON FlexFi 5G femtocells as devices under test (DUT). The setup highlights the adaptability of the test platform...
ESA Signs Contract with Venturi Space for A Study Related to Future Lunar Rover Technologies
Under a contract signed with the European Space Agency (ESA), Venturi Space has been conducting, since 1 January 2026, a risk reduction study focusing on three key technologies for future lunar rovers. This study will also make it possible to demonstrate, through dedicated test campaigns, the effectiveness of the technologies developed by the company.
New eBook from Mouser, Microchip, and Samtec Examines PCIe Design for Emerging Embedded Systems
Mouser Electronics, Inc., the authorised global distributor with the newest electronic components and industrial automation products, announces a new eBook produced in collaboration with Microchip Technology and Samtec. Titled 8 Experts on PCIe for Emerging Embedded Systems, the eBook brings together insights from industry leaders, including Bosch, DANA, Microchip, Samtec, Synopsys, Tektronix, and Visteon, to help engineers address the design challenges associated with PCIe...
Teledyne FLIR OEM Launches Lepton XDS at Mobile World Congress; A Compact Thermal‑Visible Camera Module Featuring Patented MSX Technology
Teledyne FLIR OEM, a part of Teledyne Technologies Incorporated, announced the launch of the Lepton XDS, a compact dual‑thermal‑and‑visible camera module bringing Teledyne FLIR’s patented MSX (Multi‑Spectral Dynamic Imaging) technology to a new class of space‑ and power‑constrained Original Equipment Manufacturer (OEM) products. Designed for rapid integration, the International Traffic in Arms Regulations (ITAR) -free Lepton XDS reduces...
KD and Hitachi High-Tech Enter Distribution Agreement
Semiconductor company KD proudly announced a distribution agreement with Hitachi High-Tech Corporation (“Hitachi High-Tech”). Under the agreement, Hitachi High-Tech will support market access and customer engagement for KD’s integrated optoelectronic devices in Japan, making it easier for automotive Tier-1s and suppliers to evaluate and adopt optical multigigabit connectivity solutions for next-generation vehicle architectures.
Takahiro...
Luminous Power Technologies Showcases its Complete Solar and Energy Storage Portfolio at Intersolar India 2026
Intersolar India 2026:
Luminous Power Technologies, India's leading consumer energy fulfilment company, will showcase its comprehensive portfolio of solar and energy storage solutions at the Intersolar India 2026, taking place from February 25–27, 2026, at Hall no. 1, Stall C-101, Helipad Exhibition Centre, Gandhinagar.
Luminous Power Technologies continues to advance...
Renesas R-Car V4H ADAS SoC Selected for Toyota RAV4 Model
R-Car V4H ADAS SoC:
Renesas ADAS automotive SoC, R-Car V4H has been selected for the TSS(LSS) control unit supplied by Denso for Toyota's new RAV4 model
R-Car V4H performs core ADAS signal processing such as camera, radar sensing and Driver Monitor, supporting higher levels of vehicle safety
MIPI Alliance Releases UniPro v3.0 and M-PHY v6.0, Accelerating JEDEC UFS Performance for Edge AI in Mobile, PC and Automotive
The MIPI Alliance, an international organization that develops specifications that standardize wired interfaces for mobile and other connected ecosystems, announced major updates to two of its foundational specifications. MIPI UniPro v3.0 and MIPI M-PHY v6.0 offer significant performance, latency and power-efficiency improvements for next-generation JEDEC Universal Flash Storage (UFS 5.0) solutions to support greater edge AI workloads in smartphones, tablets, PCs, gaming consoles,...
MHI Unveils “DIAVAULT,” a Secure, High Performance Edge Data Center Platform
DIAVAULT edge data center platform:
Provides integrated power, cooling systems, and data processing, simultaneously enabling on-site information processing and stable operation
This new secure, edge data center platform will serve as the foundation of MHI's Industrial Digital Infrastructure business
Mitsubishi Heavy Industries, Ltd....
















