Electronicsmedia

Designing high-performance RF systems demands precision in synchronization, efficient data transfer, and intelligent hardware-software integration. Join AMD and iWave for a technical deep dive into how advanced RFSoC and Versal RF platforms are redefining next generation RF design. This webinar will explore the combined capabilities of AMD’s Zynq UltraScale+ RFSoC and Versal RF Series...

Mouser Electronics, Inc., the industry's leading New Product Introduction (NPI) distributor with the widest selection of semiconductors and electronic components, broadens its portfolio of solutions designed to support the next generation of industrial automation systems. As industrial operations become increasingly connected and data-driven, manufacturers are seeking solutions that improve efficiency and enhance safety while reducing complexity across production...

Asahi Kasei Microdevices Corporation (AKM) has announced that its commercialization of thin-film Hall elements, initiated in 1983, has been recognized as an IEEE Milestone by the Institute of Electrical and Electronics Engineers (IEEE). The IEEE Milestone program honors historic achievements that represent groundbreaking innovations in electrical and electronic engineering. To be recognized, at least 25 years must...

Highlights-  AuraML partners with NVIDIA to build a multimodal world simulation platform for robotics and logistics Launches AuraSim,  India's first multimodal world simulation model for robotics Converts text floorplans and videos into physics-ready robot training environments Enables simulation of factory operations and logistics...

Vishay Intertechnology, Inc. introduced a new series of AEC-Q200 qualified thick film chip resistors in the ultra compact 0201 case size. Offering a miniature footprint of just 0.6 mm by 0.3 mm by 0.23 mm, the CRCW0201-AT e3 series devices provide designers with a reliable, space-saving solution for automotive, industrial, and telecommunications applications. Compared to...

ETV (Emisiona tehnika i veze), Serbia’s public broadcaster, has selected Rohde & Schwarz to upgrade its core transmitter site at Avala, serving the capital city of Belgrade. The project will deploy the first 5G Broadcast transmitter in Serbia, to boost the country's broadcasting capabilities ahead of EXPO 2027. The collaboration builds on a long-standing relationship between...

YINCAE Advanced Materials Co., Ltd. (YINCAE), a leading developer and manufacturer of high-performance semiconductor and electronic assembly materials, will exhibit at APEX 2026, March 17–19, at the Anaheim Convention Center in Anaheim, California. At booth #4130, YINCAE will showcase advanced materials engineered to enhance reliability, optimize thermal performance, and improve manufacturing efficiency for next-generation...

Researchers at CEA-Leti and CEA-IRIG-SyMMES have validated a chip-scale electron paramagnetic resonance (EPR) spectrometer that achieves unprecedented scan speed, spectral span, and sensitivity from a battery-operated integrated circuit. By replacing the bulky electromagnets used in conventional EPR instruments with an ultra-fast frequency-scanned architecture, the system enables high-performance paramagnetic sensing in portable and space-constrained environments where traditional systems...

Mouser Electronics, Inc., the authorized global distributor with the newest electronic components and industrial automation products, is now stocking the new TMAG5134 In-Plane Hall-Effect switch from Texas Instruments. The TMAG5134 is a high-sensitivity, low-power digital switch designed to replace TMR, AMR, and reed switches for sensors, consumer, medical, IoT, and metering applications. The TI TMAG5134 In-Plane Hall-Effect switch, available from Mouser, features an integrated magnetic...

3D Interconnect Designer: Keysight Technologies, Inc. introduced 3D Interconnect Designer, a new addition to its Electronic Design Automation (EDA) portfolio. The solution addresses the mounting complexity of designing 3D interconnects for high-chiplet and 3DIC advanced packages used in AI infrastructure and data center applications. As chiplet architectures are increasingly adopted, engineers...