Electronicsmedia

Gold Solder Solutions: Indium Corporation will feature its high-reliability AuLTRA MediPro gold solder solutions at MD&M West, February 3-5, in Anaheim, Calif. AuLTRA MediPro is a family of high-performance, precision gold solder materials for critical medical applications.  Indium Corporation will showcase the following among its featured products: AuLTRA Fine Wire: AuSn wire...

MCX Cable Assemblies: Amphenol RF is pleased to announce the expansion of our cable assembly portfolio with MCX straight and right-angle plug configurations that feature rugged IP67 bulkhead SMA, TNC, RP-TNC and N-Type straight jacks. These assemblies are designed on flexible RG-316 cable which provides excellent electrical performance up to 6 GHz and...

Keiron Printing Technologies, a global innovator in advanced electronics manufacturing solutions, announced the appointment of PIT Equipment Services as a sales and technical support representative for its LiFT (Laser-Induced Forward Transfer) technology. PIT will work closely with manufacturers to evaluate, implement, and optimize Keiron’s fully digital solder paste printing solutions in production environments. Under...

Berg Insight, the leading IoT market research provider, released new findings about the market for Electronic Monitoring (EM) of offenders. The number of simultaneous participants in EM programmes in Europe, North America, Latin America and Oceania amounted to about 92,000, 564,000, 162,000 and 11,000 respectively during 2025. The total number of EM programme participants during the full...

Murata Manufacturing Co., Ltd. (President: Norio Nakajima; hereinafter, "Murata") is pleased to announce that it has entered into a virtual PPA with Cosmo Eco Power Co., Ltd. (President: Fumiaki Nokura; hereinafter, "Cosmo Eco Power") effective January 14, 2026.  Through this PPA, Murata will receive environmental value with additionality in the form of NFCs from Oita...

New 5G Base Station Radio Unit: NEC Corporation announced the development of a new Radio Unit (RU) for 5G Sub-6GHz band base stations, featuring Massive MIMO technology. The new device is a successor to NEC's current integrated antenna RU and is scheduled for release in the first half of fiscal year 2026, following performance...

Software-Defined Vehicles (SDVs): GlobalLogic Inc., a Hitachi Group Company and a leader in Digital Engineering, announced a major strategic expansion of its long-standing partnership with Elektrobit, a global pioneer in automotive software. The alliance will accelerate the development and market adoption of next-generation software-defined vehicle (SDV) platforms. GlobalLogic and Elektrobit...

TDK Corporation announces the extension of its high-performance MEMS inertial sensors portfolio with Tronics AXO315T1, a high-temperature MEMS accelerometer with ±14 g input range and a digital interface for measurement while drilling (MWD) applications operating up to +175 °C. With this launch, TDK is taking the next step in temperature robustness, following the release...

Amphenol Industrial Operations announces the Floating Mate Connector Series, a compact, high-current hybrid interface engineered for modular battery architectures where drawers, slide-in power shelves, or serviceable energy modules connect reliably at the rack or cabinet level. As energy storage systems (ESS) and electrified platforms continue to increase power density within tighter mechanical envelopes, designers adopt modular, replaceable...

Emerson is expanding access to its field-proven NI PXI test platform with new high-performance hardware at a more affordable price point. These additions make it easier for more engineering teams to adopt scalable, low-cost automated test systems without compromising precision or reliability, while laying the groundwork for AI-enhanced workflows. The new NI PXI hardware—including high-resolution oscilloscopes,...